JPS59155755U - Shield type circuit board - Google Patents

Shield type circuit board

Info

Publication number
JPS59155755U
JPS59155755U JP4966883U JP4966883U JPS59155755U JP S59155755 U JPS59155755 U JP S59155755U JP 4966883 U JP4966883 U JP 4966883U JP 4966883 U JP4966883 U JP 4966883U JP S59155755 U JPS59155755 U JP S59155755U
Authority
JP
Japan
Prior art keywords
circuit board
type circuit
shield type
printed wiring
wiring conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4966883U
Other languages
Japanese (ja)
Inventor
稔 高谷
Original Assignee
ティーディーケイ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ティーディーケイ株式会社 filed Critical ティーディーケイ株式会社
Priority to JP4966883U priority Critical patent/JPS59155755U/en
Publication of JPS59155755U publication Critical patent/JPS59155755U/en
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案のシールド型回路板の平面図で磁気シー
ルド形成前の状態を示す図、及び第２図は同回路板の断
面図である。 図中主な部分は次の通りである。１：シールド型回路板
、２：絶縁基板、３ニブリント配線溝体、４：半田付部
、５：磁気シールド層。FIG. 1 is a plan view of the shield type circuit board of the present invention, showing the state before the magnetic shield is formed, and FIG. 2 is a sectional view of the same circuit board. The main parts in the figure are as follows. 1: Shield type circuit board, 2: Insulating substrate, 3 Niblint wiring groove body, 4: Soldering part, 5: Magnetic shield layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板と、前記基板の表面に形成されたプリント配線
導体とから成る回路板において、前記プリント配線導体
の半田付けを行うべき個所を除（該導体の表面と、少く
とも磁気シールドを要する前記絶縁基板の表面部分とに
、高透磁率の磁性粉を混合した樹脂より成る電気絶縁層
を形成したことを特徴とする、シールド型回路板。In a circuit board consisting of an insulating substrate and a printed wiring conductor formed on the surface of the substrate, excluding the portion where the printed wiring conductor is to be soldered (the surface of the conductor and the insulation requiring at least magnetic shielding) A shield type circuit board characterized in that an electrically insulating layer made of a resin mixed with high permeability magnetic powder is formed on the surface of the board.
JP4966883U 1983-04-05 1983-04-05 Shield type circuit board Pending JPS59155755U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4966883U JPS59155755U (en) 1983-04-05 1983-04-05 Shield type circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4966883U JPS59155755U (en) 1983-04-05 1983-04-05 Shield type circuit board

Publications (1)

Publication Number Publication Date
JPS59155755U true JPS59155755U (en) 1984-10-19

Family

ID=30180166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4966883U Pending JPS59155755U (en) 1983-04-05 1983-04-05 Shield type circuit board

Country Status (1)

Country Link
JP (1) JPS59155755U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015103745A (en) * 2013-11-27 2015-06-04 京セラ株式会社 Wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015103745A (en) * 2013-11-27 2015-06-04 京セラ株式会社 Wiring board

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