JPS60192456U - Mixed function circuit device with protective cap - Google Patents

Mixed function circuit device with protective cap

Info

Publication number
JPS60192456U
JPS60192456U JP8119884U JP8119884U JPS60192456U JP S60192456 U JPS60192456 U JP S60192456U JP 8119884 U JP8119884 U JP 8119884U JP 8119884 U JP8119884 U JP 8119884U JP S60192456 U JPS60192456 U JP S60192456U
Authority
JP
Japan
Prior art keywords
protective cap
circuit device
function circuit
mixed function
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8119884U
Other languages
Japanese (ja)
Inventor
拓也 西村
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP8119884U priority Critical patent/JPS60192456U/en
Publication of JPS60192456U publication Critical patent/JPS60192456U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の保護キャップ付き混合機能回路装置の
実施例横断面図、第2図および第3図はそれぞれ従来の
保護キャップ付き混合機能回路装置の製造工程における
横断面図と側面図である。 1・・・導体パターン、2・・・基板、3,3′・・・
入出力リード、4・・・電子部品、5,5′・・・保護
キャップ、6・・・封止用メタライズ部、7・・・封止
ガラス、8・・・ポンディングパッド、9・・・導電ペ
ースト。
FIG. 1 is a cross-sectional view of an embodiment of the mixed-function circuit device with a protective cap of the present invention, and FIGS. 2 and 3 are a cross-sectional view and a side view, respectively, of a conventional mixed-function circuit device with a protective cap in the manufacturing process. be. 1... Conductor pattern, 2... Board, 3, 3'...
Input/output lead, 4... Electronic component, 5, 5'... Protective cap, 6... Metallized portion for sealing, 7... Sealing glass, 8... Ponding pad, 9...・Conductive paste.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導体パターンを有する絶縁基板と、この絶縁基板上に搭
載され前記導体パターンに電気接続された電子部品と、
この電子部品を気密に覆う保護キャップと、この保護キ
ャップを貫通して前記導体パターンに電気接続された入
出力リードとから成ることを特徴とする保護キャップ付
き混合機能回路装置。
an insulating substrate having a conductive pattern; an electronic component mounted on the insulating substrate and electrically connected to the conductive pattern;
A mixed function circuit device with a protective cap, comprising a protective cap that airtightly covers the electronic component, and an input/output lead that passes through the protective cap and is electrically connected to the conductive pattern.
JP8119884U 1984-05-31 1984-05-31 Mixed function circuit device with protective cap Pending JPS60192456U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8119884U JPS60192456U (en) 1984-05-31 1984-05-31 Mixed function circuit device with protective cap

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8119884U JPS60192456U (en) 1984-05-31 1984-05-31 Mixed function circuit device with protective cap

Publications (1)

Publication Number Publication Date
JPS60192456U true JPS60192456U (en) 1985-12-20

Family

ID=30627757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8119884U Pending JPS60192456U (en) 1984-05-31 1984-05-31 Mixed function circuit device with protective cap

Country Status (1)

Country Link
JP (1) JPS60192456U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62217641A (en) * 1986-03-18 1987-09-25 Kyocera Corp Package for containing hybrid integrated circuit element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62217641A (en) * 1986-03-18 1987-09-25 Kyocera Corp Package for containing hybrid integrated circuit element

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