JPS59158334U - circuit parts - Google Patents

circuit parts

Info

Publication number
JPS59158334U
JPS59158334U JP5193483U JP5193483U JPS59158334U JP S59158334 U JPS59158334 U JP S59158334U JP 5193483 U JP5193483 U JP 5193483U JP 5193483 U JP5193483 U JP 5193483U JP S59158334 U JPS59158334 U JP S59158334U
Authority
JP
Japan
Prior art keywords
circuit parts
gui
pad
firing
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5193483U
Other languages
Japanese (ja)
Inventor
功 橋本
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP5193483U priority Critical patent/JPS59158334U/en
Publication of JPS59158334U publication Critical patent/JPS59158334U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a〜Cは、従来のグイパッドにおけるチップ部品
の実装方法を示す概略図、第2図a = bは第1図を
改良したチップ部品の実装方法を示す概略図、第3図は
この考案の一実施例を示す概略図であり、1は回路基板
、2はグイパッド、3は導電性接着剤、4はチップ部品
、5は回路導体、6はガイド部、7はブロック状ガイド
部である。
Figures 1 a to C are schematic diagrams showing a method for mounting chip components on a conventional Guipad, Figure 2 a = b is a schematic diagram showing a method for mounting chip components that is an improved version of Figure 1, and Figure 3 is a schematic diagram showing a method for mounting chip components on a conventional Guipad. 1 is a schematic diagram showing an embodiment of the invention, in which 1 is a circuit board, 2 is a Gui pad, 3 is a conductive adhesive, 4 is a chip component, 5 is a circuit conductor, 6 is a guide portion, and 7 is a block-shaped guide portion. be.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路基板上に導体ペーストの印刷及び焼成によって形成
され、その上に接着剤によって素子が実装されるグイバ
ットと、このグイバットの外周に沿って設けられ、かつ
このグイパッドの外形寸法と同一かもしくは若干太き目
に印刷及び焼成によってブロック状に形成す゛るととも
に上記素子の取付は時には位置決め用のガイドとなり得
る絶縁体部とから構成され、上記グイパッド上に素子を
取付ける場合に用いられる上記接着剤のグイパッド外周
への流出を上記絶縁体部によって防ぐようにしであるこ
とを特徴とする回路部品。    ゛
A gui pad is formed by printing and firing a conductive paste on a circuit board, and an element is mounted on the gui pad using an adhesive. The element is formed into a block shape by printing and firing on the surface, and an insulating part that can sometimes serve as a guide for positioning is used to attach the element. A circuit component characterized in that the insulator portion prevents leakage to the circuit component.゛
JP5193483U 1983-04-07 1983-04-07 circuit parts Pending JPS59158334U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5193483U JPS59158334U (en) 1983-04-07 1983-04-07 circuit parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5193483U JPS59158334U (en) 1983-04-07 1983-04-07 circuit parts

Publications (1)

Publication Number Publication Date
JPS59158334U true JPS59158334U (en) 1984-10-24

Family

ID=30182317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5193483U Pending JPS59158334U (en) 1983-04-07 1983-04-07 circuit parts

Country Status (1)

Country Link
JP (1) JPS59158334U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02127059U (en) * 1989-03-30 1990-10-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02127059U (en) * 1989-03-30 1990-10-19

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