JPS59158334U - circuit parts - Google Patents
circuit partsInfo
- Publication number
- JPS59158334U JPS59158334U JP5193483U JP5193483U JPS59158334U JP S59158334 U JPS59158334 U JP S59158334U JP 5193483 U JP5193483 U JP 5193483U JP 5193483 U JP5193483 U JP 5193483U JP S59158334 U JPS59158334 U JP S59158334U
- Authority
- JP
- Japan
- Prior art keywords
- circuit parts
- gui
- pad
- firing
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図a〜Cは、従来のグイパッドにおけるチップ部品
の実装方法を示す概略図、第2図a = bは第1図を
改良したチップ部品の実装方法を示す概略図、第3図は
この考案の一実施例を示す概略図であり、1は回路基板
、2はグイパッド、3は導電性接着剤、4はチップ部品
、5は回路導体、6はガイド部、7はブロック状ガイド
部である。Figures 1 a to C are schematic diagrams showing a method for mounting chip components on a conventional Guipad, Figure 2 a = b is a schematic diagram showing a method for mounting chip components that is an improved version of Figure 1, and Figure 3 is a schematic diagram showing a method for mounting chip components on a conventional Guipad. 1 is a schematic diagram showing an embodiment of the invention, in which 1 is a circuit board, 2 is a Gui pad, 3 is a conductive adhesive, 4 is a chip component, 5 is a circuit conductor, 6 is a guide portion, and 7 is a block-shaped guide portion. be.
Claims (1)
され、その上に接着剤によって素子が実装されるグイバ
ットと、このグイバットの外周に沿って設けられ、かつ
このグイパッドの外形寸法と同一かもしくは若干太き目
に印刷及び焼成によってブロック状に形成す゛るととも
に上記素子の取付は時には位置決め用のガイドとなり得
る絶縁体部とから構成され、上記グイパッド上に素子を
取付ける場合に用いられる上記接着剤のグイパッド外周
への流出を上記絶縁体部によって防ぐようにしであるこ
とを特徴とする回路部品。 ゛A gui pad is formed by printing and firing a conductive paste on a circuit board, and an element is mounted on the gui pad using an adhesive. The element is formed into a block shape by printing and firing on the surface, and an insulating part that can sometimes serve as a guide for positioning is used to attach the element. A circuit component characterized in that the insulator portion prevents leakage to the circuit component.゛
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5193483U JPS59158334U (en) | 1983-04-07 | 1983-04-07 | circuit parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5193483U JPS59158334U (en) | 1983-04-07 | 1983-04-07 | circuit parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59158334U true JPS59158334U (en) | 1984-10-24 |
Family
ID=30182317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5193483U Pending JPS59158334U (en) | 1983-04-07 | 1983-04-07 | circuit parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59158334U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02127059U (en) * | 1989-03-30 | 1990-10-19 |
-
1983
- 1983-04-07 JP JP5193483U patent/JPS59158334U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02127059U (en) * | 1989-03-30 | 1990-10-19 |
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