JPS59101425U - electronic components - Google Patents
electronic componentsInfo
- Publication number
- JPS59101425U JPS59101425U JP19531782U JP19531782U JPS59101425U JP S59101425 U JPS59101425 U JP S59101425U JP 19531782 U JP19531782 U JP 19531782U JP 19531782 U JP19531782 U JP 19531782U JP S59101425 U JPS59101425 U JP S59101425U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- terminals
- substrate
- electronic components
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１゛図及び第２図は、それぞれ従来の電子部品におけ
る端子部の側面図、第３図及び第４図はコンデンサに適
用された本考案の１実施例の平面図及び側面図、第５図
は瞳合部品に適用された本考案あ他の実施例の側面図、
第６図及び第７図は第５図の変形例の羊面図及び側面図
を示す。
１・・・・・・絶縁基板、２・・・・・・端子、３・・
・・・・外部接続用電極、４・・・・・・導電性接合材
。Figures 1 and 2 are side views of a terminal section in a conventional electronic component, Figures 3 and 4 are a plan view and side view of an embodiment of the present invention applied to a capacitor, and Figure 5 is a side view of a terminal section of a conventional electronic component. The figure is a side view of another embodiment of the present invention applied to a pupil alignment component.
6 and 7 show a sheep side view and a side view of a modification of FIG. 5. 1...Insulating board, 2...Terminal, 3...
...External connection electrode, 4... Conductive bonding material.
Claims (1)
配設又は形成された電子部品において、前記端子２はコ
字状金属端子から成り、前記絶縁基板１の周一縁に嵌合
されると共に該基板１上に形゛ 成された電子部品の
外部接続用電極３に導電性接合材４で接続されて成る電
子部品。 ・In an electronic component provided with terminals 2 extending on both sides of the insulating substrate 1 and disposed or formed on the substrate 1, the terminals 2 are made of U-shaped metal terminals and are fitted to one edge of the periphery of the insulating substrate 1. The electronic component is connected to an external connection electrode 3 of the electronic component formed on the substrate 1 with a conductive bonding material 4.・
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19531782U JPS59101425U (en) | 1982-12-25 | 1982-12-25 | electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19531782U JPS59101425U (en) | 1982-12-25 | 1982-12-25 | electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59101425U true JPS59101425U (en) | 1984-07-09 |
Family
ID=30419540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19531782U Pending JPS59101425U (en) | 1982-12-25 | 1982-12-25 | electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59101425U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015095646A (en) * | 2013-11-14 | 2015-05-18 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Multilayer ceramic electronic component, and mounting substrate of multilayer ceramic electronic component |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5683002A (en) * | 1979-12-10 | 1981-07-07 | Matsushita Electric Ind Co Ltd | Electric part |
-
1982
- 1982-12-25 JP JP19531782U patent/JPS59101425U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5683002A (en) * | 1979-12-10 | 1981-07-07 | Matsushita Electric Ind Co Ltd | Electric part |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015095646A (en) * | 2013-11-14 | 2015-05-18 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Multilayer ceramic electronic component, and mounting substrate of multilayer ceramic electronic component |
| US9526174B2 (en) | 2013-11-14 | 2016-12-20 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component and board having the same mounted thereon |
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