JPS59155732U - Chip type electronic components - Google Patents
Chip type electronic componentsInfo
- Publication number
- JPS59155732U JPS59155732U JP5007683U JP5007683U JPS59155732U JP S59155732 U JPS59155732 U JP S59155732U JP 5007683 U JP5007683 U JP 5007683U JP 5007683 U JP5007683 U JP 5007683U JP S59155732 U JPS59155732 U JP S59155732U
- Authority
- JP
- Japan
- Prior art keywords
- type electronic
- chip type
- electronic components
- electrode part
- thin metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ceramic Capacitors (AREA)
- Details Of Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図及び第2図は従来の断面図、第3図は本考案の展
開図、第4図は斜視図、第5図は断面図である。
図面において、11は絶縁基板、12は金属薄板、14
.15は電極部、16は索子、18は端子、19は導電
性接着剤、20は絶縁樹脂。1 and 2 are sectional views of the conventional device, FIG. 3 is a developed view of the present invention, FIG. 4 is a perspective view, and FIG. 5 is a sectional view. In the drawing, 11 is an insulating substrate, 12 is a thin metal plate, and 14
.. 15 is an electrode part, 16 is a cord, 18 is a terminal, 19 is a conductive adhesive, and 20 is an insulating resin.
Claims (1)
らの金属薄板の端部の三面を立上らせて折曲しコ字形箱
状の電極部を形成し、一方の電極部には索子を、他方の
電極部には端子を半田付けまたは導電性接着剤で電気的
に接続することを特徴とするチップ型電子部品。Solderable thin metal plates are fixed to both ends of the insulating plate, and the three ends of these thin metal plates are raised and bent to form a U-shaped box-shaped electrode part. A chip type electronic component, characterized in that a cable is electrically connected to the other electrode part and a terminal is electrically connected to the other electrode part by soldering or conductive adhesive.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5007683U JPS59155732U (en) | 1983-04-04 | 1983-04-04 | Chip type electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5007683U JPS59155732U (en) | 1983-04-04 | 1983-04-04 | Chip type electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59155732U true JPS59155732U (en) | 1984-10-19 |
Family
ID=30180557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5007683U Pending JPS59155732U (en) | 1983-04-04 | 1983-04-04 | Chip type electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59155732U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023181748A1 (en) * | 2022-03-23 | 2023-09-28 | パナソニックIpマネジメント株式会社 | Surface-mounted solid electrolytic capacitor, module, and electronic device |
-
1983
- 1983-04-04 JP JP5007683U patent/JPS59155732U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023181748A1 (en) * | 2022-03-23 | 2023-09-28 | パナソニックIpマネジメント株式会社 | Surface-mounted solid electrolytic capacitor, module, and electronic device |
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