JPS58191637U - Internal connection terminals for semiconductor devices - Google Patents

Internal connection terminals for semiconductor devices

Info

Publication number
JPS58191637U
JPS58191637U JP1982066573U JP6657382U JPS58191637U JP S58191637 U JPS58191637 U JP S58191637U JP 1982066573 U JP1982066573 U JP 1982066573U JP 6657382 U JP6657382 U JP 6657382U JP S58191637 U JPS58191637 U JP S58191637U
Authority
JP
Japan
Prior art keywords
internal connection
semiconductor devices
connection terminals
connection terminal
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982066573U
Other languages
Japanese (ja)
Inventor
仙田　孝雄
海老原　廣司
Original Assignee
日本インター株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本インター株式会社 filed Critical 日本インター株式会社
Priority to JP1982066573U priority Critical patent/JPS58191637U/en
Publication of JPS58191637U publication Critical patent/JPS58191637U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/621—Structures or relative sizes of strap connectors
    • H10W72/622—Multilayered strap connectors, e.g. having a coating on a lowermost surface of a core
    • H10W72/623—Multilayered strap connectors, e.g. having a coating on a lowermost surface of a core characterised by the structures of the outermost layers, e.g. multilayered coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ないし第２図は、従来の半導体装置用内部接続端
子の構成例を示す図、第３図は、本考案に係る内部接続
端子を形成するためのソルダクラツド板の斜視図、第４
図は、本考案に係る内部接続端子の斜斜図、第５図は、
上記端子を用いて装置を組立てた状態の側面図である。 １・・・基板、２・・・ソルダ片、３・・・半導体チッ
プ、７・・・外部導出端子、１１・・・ソルダ、１２・
・・内部接続端子。1 and 2 are diagrams showing a configuration example of a conventional internal connection terminal for a semiconductor device, FIG. 3 is a perspective view of a solder clad plate for forming an internal connection terminal according to the present invention, and FIG.
The figure is a perspective view of an internal connection terminal according to the present invention, and FIG.
FIG. 3 is a side view of the device assembled using the terminals. DESCRIPTION OF SYMBOLS 1... Board, 2... Solder piece, 3... Semiconductor chip, 7... External lead-out terminal, 11... Solder, 12...
...Internal connection terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板に固着された半導体チップの表面と外部導出端子の
一端とを接続する内部接続端子の片面にソルダをクラッ
ドしたことを特徴とする半導体装置用内部接続端子。An internal connection terminal for a semiconductor device, characterized in that one side of an internal connection terminal that connects the surface of a semiconductor chip fixed to a substrate and one end of an external lead-out terminal is clad with solder.
JP1982066573U 1982-05-10 1982-05-10 Internal connection terminals for semiconductor devices Pending JPS58191637U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982066573U JPS58191637U (en) 1982-05-10 1982-05-10 Internal connection terminals for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982066573U JPS58191637U (en) 1982-05-10 1982-05-10 Internal connection terminals for semiconductor devices

Publications (1)

Publication Number Publication Date
JPS58191637U true JPS58191637U (en) 1983-12-20

Family

ID=30076438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982066573U Pending JPS58191637U (en) 1982-05-10 1982-05-10 Internal connection terminals for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS58191637U (en)

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