JPS5869935U - Lead plate for connecting ultra-thin ICs - Google Patents

Lead plate for connecting ultra-thin ICs

Info

Publication number
JPS5869935U
JPS5869935U JP1981165115U JP16511581U JPS5869935U JP S5869935 U JPS5869935 U JP S5869935U JP 1981165115 U JP1981165115 U JP 1981165115U JP 16511581 U JP16511581 U JP 16511581U JP S5869935 U JPS5869935 U JP S5869935U
Authority
JP
Japan
Prior art keywords
lead plate
thin
ultra
ics
connecting ultra
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981165115U
Other languages
Japanese (ja)
Inventor
功力　正
誠一 西川
浩一 岡田
輝明 城
Original Assignee
大日本印刷株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大日本印刷株式会社 filed Critical 大日本印刷株式会社
Priority to JP1981165115U priority Critical patent/JPS5869935U/en
Publication of JPS5869935U publication Critical patent/JPS5869935U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のリード板による接続の様子を示す図、第
２図はこの考案の一実施例を示す斜視図、第３図Ａ、　
Ｂはこの考案によるリード板の接続方法を説明するため
の図、第４図及び第５図はそれぞれこの考案の他の応用
例を示す図である。 １・・・・・・ＩＣ（集積回路）、２・・・・・・電極
端子、３・・・・・・突起片、４・・・・・・回路ベー
ス、５・・・・・・ボンディング、６．６Ａ・・・・・
・リード板。Fig. 1 is a diagram showing a state of connection using a conventional lead plate, Fig. 2 is a perspective view showing an embodiment of this invention, Fig. 3A,
B is a diagram for explaining a method of connecting lead plates according to this invention, and FIGS. 4 and 5 are diagrams showing other application examples of this invention, respectively. 1...IC (integrated circuit), 2...electrode terminal, 3...protrusion piece, 4...circuit base, 5... Bonding, 6.6A...
・Lead board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 極薄型ＩＣの電極端子を回路ベースに接続するための長
形状の導電性リード板であって、前記リード板の端部近
辺の一表面に凹部を設けることによって、−前記ＩＣ端
子を前記リード板端部の突起部において接続し得るよう
にしたことを特徴とする極薄型ＩＣの接続用リード板。An elongated conductive lead plate for connecting an electrode terminal of an ultra-thin IC to a circuit base, the IC terminal being connected to the lead plate by providing a recess on one surface near the end of the lead plate. A lead plate for connecting an ultra-thin IC, characterized in that connection can be made at the protrusion at the end.
JP1981165115U 1981-11-05 1981-11-05 Lead plate for connecting ultra-thin ICs Pending JPS5869935U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981165115U JPS5869935U (en) 1981-11-05 1981-11-05 Lead plate for connecting ultra-thin ICs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981165115U JPS5869935U (en) 1981-11-05 1981-11-05 Lead plate for connecting ultra-thin ICs

Publications (1)

Publication Number Publication Date
JPS5869935U true JPS5869935U (en) 1983-05-12

Family

ID=29957323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981165115U Pending JPS5869935U (en) 1981-11-05 1981-11-05 Lead plate for connecting ultra-thin ICs

Country Status (1)

Country Link
JP (1) JPS5869935U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5261480A (en) * 1975-11-17 1977-05-20 Seiko Instr & Electronics Ltd Production of lead frame for ic

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5261480A (en) * 1975-11-17 1977-05-20 Seiko Instr & Electronics Ltd Production of lead frame for ic

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