JPS5261480A - Production of lead frame for ic - Google Patents

Production of lead frame for ic

Info

Publication number
JPS5261480A
JPS5261480A JP50138001A JP13800175A JPS5261480A JP S5261480 A JPS5261480 A JP S5261480A JP 50138001 A JP50138001 A JP 50138001A JP 13800175 A JP13800175 A JP 13800175A JP S5261480 A JPS5261480 A JP S5261480A
Authority
JP
Japan
Prior art keywords
production
lead frame
lead frames
affixing
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50138001A
Other languages
Japanese (ja)
Inventor
Isao Misaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP50138001A priority Critical patent/JPS5261480A/en
Publication of JPS5261480A publication Critical patent/JPS5261480A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Abstract

PURPOSE: Lead frames are continuously produced by making lead frames through affixing of a copper foil on a strip-form resin substrate and photo etching, then plating the lead frames and simultaneously welding the pads of IC chips and leads.
COPYRIGHT: (C)1977,JPO&Japio
JP50138001A 1975-11-17 1975-11-17 Production of lead frame for ic Pending JPS5261480A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50138001A JPS5261480A (en) 1975-11-17 1975-11-17 Production of lead frame for ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50138001A JPS5261480A (en) 1975-11-17 1975-11-17 Production of lead frame for ic

Publications (1)

Publication Number Publication Date
JPS5261480A true JPS5261480A (en) 1977-05-20

Family

ID=15211735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50138001A Pending JPS5261480A (en) 1975-11-17 1975-11-17 Production of lead frame for ic

Country Status (1)

Country Link
JP (1) JPS5261480A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619632A (en) * 1979-07-26 1981-02-24 Seiko Epson Corp Lead terminal
JPS5621353A (en) * 1979-07-27 1981-02-27 Seiko Epson Corp Electronic parts device
JPS5869935U (en) * 1981-11-05 1983-05-12 大日本印刷株式会社 Lead plate for connecting ultra-thin ICs

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619632A (en) * 1979-07-26 1981-02-24 Seiko Epson Corp Lead terminal
JPS6258146B2 (en) * 1979-07-26 1987-12-04 Seiko Epson Corp
JPS5621353A (en) * 1979-07-27 1981-02-27 Seiko Epson Corp Electronic parts device
JPS5869935U (en) * 1981-11-05 1983-05-12 大日本印刷株式会社 Lead plate for connecting ultra-thin ICs

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