JPS5325394A - Se miconductor device - Google Patents

Se miconductor device

Info

Publication number
JPS5325394A
JPS5325394A JP10043076A JP10043076A JPS5325394A JP S5325394 A JPS5325394 A JP S5325394A JP 10043076 A JP10043076 A JP 10043076A JP 10043076 A JP10043076 A JP 10043076A JP S5325394 A JPS5325394 A JP S5325394A
Authority
JP
Japan
Prior art keywords
display device
miconductor
miconductor device
terminals
facilitate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10043076A
Other languages
Japanese (ja)
Inventor
Kojiro Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP10043076A priority Critical patent/JPS5325394A/en
Publication of JPS5325394A publication Critical patent/JPS5325394A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PURPOSE: To reduce the number of terminals being connected to the outside and facilitate the production of an electronic device provided with a display device by integrally forming a semiconductor chip and a display device.
COPYRIGHT: (C)1978,JPO&Japio
JP10043076A 1976-08-23 1976-08-23 Se miconductor device Pending JPS5325394A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10043076A JPS5325394A (en) 1976-08-23 1976-08-23 Se miconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10043076A JPS5325394A (en) 1976-08-23 1976-08-23 Se miconductor device

Publications (1)

Publication Number Publication Date
JPS5325394A true JPS5325394A (en) 1978-03-09

Family

ID=14273730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10043076A Pending JPS5325394A (en) 1976-08-23 1976-08-23 Se miconductor device

Country Status (1)

Country Link
JP (1) JPS5325394A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518602A (en) * 1978-07-26 1980-02-08 Hitachi Ltd Liquid crystal display

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518602A (en) * 1978-07-26 1980-02-08 Hitachi Ltd Liquid crystal display
JPS6151319B2 (en) * 1978-07-26 1986-11-08 Hitachi Ltd

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