JPS534472A - Semiconductor package - Google Patents
Semiconductor packageInfo
- Publication number
- JPS534472A JPS534472A JP7694976A JP7694976A JPS534472A JP S534472 A JPS534472 A JP S534472A JP 7694976 A JP7694976 A JP 7694976A JP 7694976 A JP7694976 A JP 7694976A JP S534472 A JPS534472 A JP S534472A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- circumference
- produce
- ceramic substrate
- leading out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To produce a semiconductor package by leading out external leads from one side of a ceramic substrate and providing conductor regions on the circumference of the other side excluding one side of an element securing part.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7694976A JPS534472A (en) | 1976-06-29 | 1976-06-29 | Semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7694976A JPS534472A (en) | 1976-06-29 | 1976-06-29 | Semiconductor package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS534472A true JPS534472A (en) | 1978-01-17 |
JPS5756773B2 JPS5756773B2 (en) | 1982-12-01 |
Family
ID=13620006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7694976A Granted JPS534472A (en) | 1976-06-29 | 1976-06-29 | Semiconductor package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS534472A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5571050A (en) * | 1978-11-24 | 1980-05-28 | Hitachi Ltd | Semiconductor device |
JPS5884961U (en) * | 1981-12-01 | 1983-06-09 | ヤマハ株式会社 | Storage and transportation equipment for heavy objects |
JPS58182292A (en) * | 1982-04-19 | 1983-10-25 | 松下電器産業株式会社 | High density mounting method |
JPS6258337U (en) * | 1985-09-30 | 1987-04-10 | ||
JP2010129661A (en) * | 2008-11-26 | 2010-06-10 | Kyocera Corp | Mounting structure of electronic device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MX2019007946A (en) | 2017-01-17 | 2019-08-29 | Nippon Steel Corp | Hot stamp molded body and method for producing same. |
KR102239115B1 (en) | 2017-01-17 | 2021-04-12 | 닛폰세이테츠 가부시키가이샤 | Steel plate for hot stamping |
-
1976
- 1976-06-29 JP JP7694976A patent/JPS534472A/en active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5571050A (en) * | 1978-11-24 | 1980-05-28 | Hitachi Ltd | Semiconductor device |
JPS5884961U (en) * | 1981-12-01 | 1983-06-09 | ヤマハ株式会社 | Storage and transportation equipment for heavy objects |
JPS58182292A (en) * | 1982-04-19 | 1983-10-25 | 松下電器産業株式会社 | High density mounting method |
JPS6258337U (en) * | 1985-09-30 | 1987-04-10 | ||
JPH0322114Y2 (en) * | 1985-09-30 | 1991-05-14 | ||
JP2010129661A (en) * | 2008-11-26 | 2010-06-10 | Kyocera Corp | Mounting structure of electronic device |
Also Published As
Publication number | Publication date |
---|---|
JPS5756773B2 (en) | 1982-12-01 |
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