JPS534472A - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
JPS534472A
JPS534472A JP7694976A JP7694976A JPS534472A JP S534472 A JPS534472 A JP S534472A JP 7694976 A JP7694976 A JP 7694976A JP 7694976 A JP7694976 A JP 7694976A JP S534472 A JPS534472 A JP S534472A
Authority
JP
Japan
Prior art keywords
semiconductor package
circumference
produce
ceramic substrate
leading out
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7694976A
Other languages
Japanese (ja)
Other versions
JPS5756773B2 (en
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7694976A priority Critical patent/JPS534472A/en
Publication of JPS534472A publication Critical patent/JPS534472A/en
Publication of JPS5756773B2 publication Critical patent/JPS5756773B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To produce a semiconductor package by leading out external leads from one side of a ceramic substrate and providing conductor regions on the circumference of the other side excluding one side of an element securing part.
COPYRIGHT: (C)1978,JPO&Japio
JP7694976A 1976-06-29 1976-06-29 Semiconductor package Granted JPS534472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7694976A JPS534472A (en) 1976-06-29 1976-06-29 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7694976A JPS534472A (en) 1976-06-29 1976-06-29 Semiconductor package

Publications (2)

Publication Number Publication Date
JPS534472A true JPS534472A (en) 1978-01-17
JPS5756773B2 JPS5756773B2 (en) 1982-12-01

Family

ID=13620006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7694976A Granted JPS534472A (en) 1976-06-29 1976-06-29 Semiconductor package

Country Status (1)

Country Link
JP (1) JPS534472A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571050A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Semiconductor device
JPS5884961U (en) * 1981-12-01 1983-06-09 ヤマハ株式会社 Storage and transportation equipment for heavy objects
JPS58182292A (en) * 1982-04-19 1983-10-25 松下電器産業株式会社 High density mounting method
JPS6258337U (en) * 1985-09-30 1987-04-10
JP2010129661A (en) * 2008-11-26 2010-06-10 Kyocera Corp Mounting structure of electronic device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2019007946A (en) 2017-01-17 2019-08-29 Nippon Steel Corp Hot stamp molded body and method for producing same.
KR102239115B1 (en) 2017-01-17 2021-04-12 닛폰세이테츠 가부시키가이샤 Steel plate for hot stamping

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571050A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Semiconductor device
JPS5884961U (en) * 1981-12-01 1983-06-09 ヤマハ株式会社 Storage and transportation equipment for heavy objects
JPS58182292A (en) * 1982-04-19 1983-10-25 松下電器産業株式会社 High density mounting method
JPS6258337U (en) * 1985-09-30 1987-04-10
JPH0322114Y2 (en) * 1985-09-30 1991-05-14
JP2010129661A (en) * 2008-11-26 2010-06-10 Kyocera Corp Mounting structure of electronic device

Also Published As

Publication number Publication date
JPS5756773B2 (en) 1982-12-01

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