JPS5211772A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5211772A
JPS5211772A JP50088159A JP8815975A JPS5211772A JP S5211772 A JPS5211772 A JP S5211772A JP 50088159 A JP50088159 A JP 50088159A JP 8815975 A JP8815975 A JP 8815975A JP S5211772 A JPS5211772 A JP S5211772A
Authority
JP
Japan
Prior art keywords
semiconductor device
electrode
polysilicon
reliability
improve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50088159A
Other languages
Japanese (ja)
Inventor
Isamu Kitahiro
Masaharu Noyori
Hiroaki Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP50088159A priority Critical patent/JPS5211772A/en
Publication of JPS5211772A publication Critical patent/JPS5211772A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Abstract

PURPOSE: To improve the reliability of the connection of the element electrode and the electrode of an insulating substrate by forming a projecting electrode with polysilicon.
COPYRIGHT: (C)1977,JPO&Japio
JP50088159A 1975-07-17 1975-07-17 Semiconductor device Pending JPS5211772A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50088159A JPS5211772A (en) 1975-07-17 1975-07-17 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50088159A JPS5211772A (en) 1975-07-17 1975-07-17 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5211772A true JPS5211772A (en) 1977-01-28

Family

ID=13935132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50088159A Pending JPS5211772A (en) 1975-07-17 1975-07-17 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5211772A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58170903A (en) * 1982-03-30 1983-10-07 Aioi Seiki Kk Change-over valve of cylinder circuit for supply, locking and discharge of pressure oil
JPH045637U (en) * 1990-04-27 1992-01-20

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58170903A (en) * 1982-03-30 1983-10-07 Aioi Seiki Kk Change-over valve of cylinder circuit for supply, locking and discharge of pressure oil
JPH0131067B2 (en) * 1982-03-30 1989-06-23 Aioi Seiki Kk
JPH045637U (en) * 1990-04-27 1992-01-20

Similar Documents

Publication Publication Date Title
JPS52156576A (en) Production of mis semiconductor device
JPS5279679A (en) Semiconductor memory device
JPS528785A (en) Semiconductor device electrode structure
JPS5380966A (en) Manufacture of electrode fdr semiconductor device
JPS5211772A (en) Semiconductor device
JPS51114069A (en) Semiconductor device
JPS5228868A (en) Semiconductor device
JPS5216166A (en) Semiconductor device
JPS5362471A (en) Semiconductor device
JPS5267963A (en) Manufacture of semiconductor unit
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS52130567A (en) Preparation of semiconductor device
JPS5212572A (en) Semi-conductor device
JPS5265667A (en) Semiconductor device
JPS5270766A (en) Semiconductor device
JPS52153383A (en) Preparation of semiconductor device
JPS51130169A (en) Semiconductor device
JPS51127678A (en) Semiconductor device and its manufacturing method
JPS533071A (en) Semiconductor device
JPS51112266A (en) Semiconductor device production method
JPS5272186A (en) Production of mis type semiconductor device
JPS5360176A (en) Semiconductor device
JPS51118965A (en) Insulation film of semiconductor device
JPS53110370A (en) Semiconductor device
JPS535580A (en) Field effect type semiconductor device