JPS5571050A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5571050A
JPS5571050A JP14420378A JP14420378A JPS5571050A JP S5571050 A JPS5571050 A JP S5571050A JP 14420378 A JP14420378 A JP 14420378A JP 14420378 A JP14420378 A JP 14420378A JP S5571050 A JPS5571050 A JP S5571050A
Authority
JP
Japan
Prior art keywords
chip
bonding
semiconductor device
multitude
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14420378A
Other languages
Japanese (ja)
Inventor
Kazuo Hoya
Noboru Horie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14420378A priority Critical patent/JPS5571050A/en
Publication of JPS5571050A publication Critical patent/JPS5571050A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0555Shape
    • H01L2224/05552Shape in top view
    • H01L2224/05554Shape in top view being square
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

Abstract

PURPOSE:To utilize chip area effectively and thus to improve integration by arranging a majority of bonding pads at one side of an IC chip in semiconductor device or particularly a single-in-line (SIL) type IC. CONSTITUTION:An IC chip 24 is fixed on a tab 20, and a multitude of bonding pads 25 are formed on the surface of this chip. The pads 25 are connected to a multitude of corresponding leads 22 by means of bonding wires 26. A resin package 28 seals a tab 20, a lead 22, the chip 24 and the wire 26 airtightly. In this case, the lead 22 is led out of one side of the resin package 28 in parallel, and wire bonding is carried out at one side of the chip 24 opposite to these leads 22.
JP14420378A 1978-11-24 1978-11-24 Semiconductor device Pending JPS5571050A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14420378A JPS5571050A (en) 1978-11-24 1978-11-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14420378A JPS5571050A (en) 1978-11-24 1978-11-24 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5571050A true JPS5571050A (en) 1980-05-28

Family

ID=15356613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14420378A Pending JPS5571050A (en) 1978-11-24 1978-11-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5571050A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0638737U (en) * 1992-11-02 1994-05-24 金雄 引地 Newspaper stand

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4918266A (en) * 1972-06-09 1974-02-18
JPS534472A (en) * 1976-06-29 1978-01-17 Nec Corp Semiconductor package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4918266A (en) * 1972-06-09 1974-02-18
JPS534472A (en) * 1976-06-29 1978-01-17 Nec Corp Semiconductor package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0638737U (en) * 1992-11-02 1994-05-24 金雄 引地 Newspaper stand

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