JPS5377172A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5377172A
JPS5377172A JP15369676A JP15369676A JPS5377172A JP S5377172 A JPS5377172 A JP S5377172A JP 15369676 A JP15369676 A JP 15369676A JP 15369676 A JP15369676 A JP 15369676A JP S5377172 A JPS5377172 A JP S5377172A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
adhesiveness
spreading
improving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15369676A
Other languages
Japanese (ja)
Inventor
Masaru Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP15369676A priority Critical patent/JPS5377172A/en
Publication of JPS5377172A publication Critical patent/JPS5377172A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Abstract

PURPOSE: To make bump terminal wirings free from side-spreading by providing a thick dry type photosensitive resin film through an active metal film on a semiconductor substrate and improving the adhesiveness at each interface.
COPYRIGHT: (C)1978,JPO&Japio
JP15369676A 1976-12-20 1976-12-20 Production of semiconductor device Pending JPS5377172A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15369676A JPS5377172A (en) 1976-12-20 1976-12-20 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15369676A JPS5377172A (en) 1976-12-20 1976-12-20 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5377172A true JPS5377172A (en) 1978-07-08

Family

ID=15568121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15369676A Pending JPS5377172A (en) 1976-12-20 1976-12-20 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5377172A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57198700A (en) * 1981-05-30 1982-12-06 Nippon Telegraph & Telephone Method of producng circuit board with micropin
JPS57198699A (en) * 1981-05-30 1982-12-06 Nippon Telegraph & Telephone Method of producing circuit board with micropin
JPS62234352A (en) * 1986-04-04 1987-10-14 Nec Corp Forming method for solder bump electrode

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57198700A (en) * 1981-05-30 1982-12-06 Nippon Telegraph & Telephone Method of producng circuit board with micropin
JPS57198699A (en) * 1981-05-30 1982-12-06 Nippon Telegraph & Telephone Method of producing circuit board with micropin
JPS62234352A (en) * 1986-04-04 1987-10-14 Nec Corp Forming method for solder bump electrode

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