JPS53118371A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS53118371A
JPS53118371A JP3348277A JP3348277A JPS53118371A JP S53118371 A JPS53118371 A JP S53118371A JP 3348277 A JP3348277 A JP 3348277A JP 3348277 A JP3348277 A JP 3348277A JP S53118371 A JPS53118371 A JP S53118371A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
groove
mesa groove
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3348277A
Other languages
Japanese (ja)
Other versions
JPS5629383B2 (en
Inventor
Hayashi Kuroki
Keishiro Yonezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP3348277A priority Critical patent/JPS53118371A/en
Publication of JPS53118371A publication Critical patent/JPS53118371A/en
Publication of JPS5629383B2 publication Critical patent/JPS5629383B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To avoid crack occurrence to the glass protecting film which is coated on the mesa groove's slope, by providing an insulating film at the bottom of the mesa groove of the semiconductor wafer to prevent the glass coating and giving a ditch at the bottom of the groove after passivation to form a pellet.
COPYRIGHT: (C)1978,JPO&Japio
JP3348277A 1977-03-25 1977-03-25 Manufacture of semiconductor device Granted JPS53118371A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3348277A JPS53118371A (en) 1977-03-25 1977-03-25 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3348277A JPS53118371A (en) 1977-03-25 1977-03-25 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS53118371A true JPS53118371A (en) 1978-10-16
JPS5629383B2 JPS5629383B2 (en) 1981-07-08

Family

ID=12387761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3348277A Granted JPS53118371A (en) 1977-03-25 1977-03-25 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS53118371A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014187143A (en) * 2013-03-22 2014-10-02 Shindengen Electric Mfg Co Ltd Substrate for forming semiconductor device, method for manufacturing the same, mesa type semiconductor device and method for manufacturing the same
JP2014187144A (en) * 2013-03-22 2014-10-02 Shindengen Electric Mfg Co Ltd Substrate for forming semiconductor device, method for manufacturing the same, mesa type semiconductor device and method for manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014187143A (en) * 2013-03-22 2014-10-02 Shindengen Electric Mfg Co Ltd Substrate for forming semiconductor device, method for manufacturing the same, mesa type semiconductor device and method for manufacturing the same
JP2014187144A (en) * 2013-03-22 2014-10-02 Shindengen Electric Mfg Co Ltd Substrate for forming semiconductor device, method for manufacturing the same, mesa type semiconductor device and method for manufacturing the same

Also Published As

Publication number Publication date
JPS5629383B2 (en) 1981-07-08

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