JPS5356969A - Production of tape for tape carrier - Google Patents

Production of tape for tape carrier

Info

Publication number
JPS5356969A
JPS5356969A JP13201676A JP13201676A JPS5356969A JP S5356969 A JPS5356969 A JP S5356969A JP 13201676 A JP13201676 A JP 13201676A JP 13201676 A JP13201676 A JP 13201676A JP S5356969 A JPS5356969 A JP S5356969A
Authority
JP
Japan
Prior art keywords
tape
production
carrier
main surface
bump electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13201676A
Inventor
Toshio Kano
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP13201676A priority Critical patent/JPS5356969A/en
Publication of JPS5356969A publication Critical patent/JPS5356969A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Abstract

PURPOSE: To readily perform bonding by providing bump electrodes conducting to the wirings on other main surface on one main surface of an insulation film and wothout providing bump electrodes on elements.
COPYRIGHT: (C)1978,JPO&Japio
JP13201676A 1976-11-02 1976-11-02 Production of tape for tape carrier Pending JPS5356969A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13201676A JPS5356969A (en) 1976-11-02 1976-11-02 Production of tape for tape carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13201676A JPS5356969A (en) 1976-11-02 1976-11-02 Production of tape for tape carrier

Publications (1)

Publication Number Publication Date
JPS5356969A true JPS5356969A (en) 1978-05-23

Family

ID=15071550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13201676A Pending JPS5356969A (en) 1976-11-02 1976-11-02 Production of tape for tape carrier

Country Status (1)

Country Link
JP (1) JPS5356969A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62139448A (en) * 1985-12-13 1987-06-23 Fujitsu Ltd Carrier recovery circuit
WO1991006977A1 (en) * 1989-11-06 1991-05-16 Nippon Mektron, Ltd. Flexible circuit board for mounting ic and method of producing the same
EP0684644A1 (en) 1994-05-25 1995-11-29 Nec Corporation Method for manufacturing bump leaded film carrier type semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62139448A (en) * 1985-12-13 1987-06-23 Fujitsu Ltd Carrier recovery circuit
WO1991006977A1 (en) * 1989-11-06 1991-05-16 Nippon Mektron, Ltd. Flexible circuit board for mounting ic and method of producing the same
EP0452506B1 (en) * 1989-11-06 1996-03-13 Nippon Mektron, Ltd. METHOD OF PRODUCING A FLEXIBLE CIRCUIT BOARD FOR MOUNTING IC's
EP0684644A1 (en) 1994-05-25 1995-11-29 Nec Corporation Method for manufacturing bump leaded film carrier type semiconductor device
US5683942A (en) * 1994-05-25 1997-11-04 Nec Corporation Method for manufacturing bump leaded film carrier type semiconductor device
US5905303A (en) * 1994-05-25 1999-05-18 Nec Corporation Method for manufacturing bump leaded film carrier type semiconductor device

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