JPS5315762A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5315762A
JPS5315762A JP9064276A JP9064276A JPS5315762A JP S5315762 A JPS5315762 A JP S5315762A JP 9064276 A JP9064276 A JP 9064276A JP 9064276 A JP9064276 A JP 9064276A JP S5315762 A JPS5315762 A JP S5315762A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
pellet
external leads
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9064276A
Other languages
Japanese (ja)
Other versions
JPS5856971B2 (en
Inventor
Takashi Ono
Takahiko Ichimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9064276A priority Critical patent/JPS5856971B2/en
Publication of JPS5315762A publication Critical patent/JPS5315762A/en
Publication of JPS5856971B2 publication Critical patent/JPS5856971B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent the external force on external leads from being directly transmitted to a pellet by performing the connection of the pellet and the external leads of a lead frame through an elastic conductive member.
COPYRIGHT: (C)1978,JPO&Japio
JP9064276A 1976-07-28 1976-07-28 Manufacturing method of semiconductor device Expired JPS5856971B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9064276A JPS5856971B2 (en) 1976-07-28 1976-07-28 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9064276A JPS5856971B2 (en) 1976-07-28 1976-07-28 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5315762A true JPS5315762A (en) 1978-02-14
JPS5856971B2 JPS5856971B2 (en) 1983-12-17

Family

ID=14004146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9064276A Expired JPS5856971B2 (en) 1976-07-28 1976-07-28 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5856971B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010131679A1 (en) * 2009-05-14 2010-11-18 ローム株式会社 Semiconductor device
JP2015149363A (en) * 2014-02-05 2015-08-20 株式会社デンソー semiconductor module
JP2016207843A (en) * 2015-04-23 2016-12-08 パナソニックＩｐマネジメント株式会社 Semiconductor device
US11996355B2 (en) 2019-10-17 2024-05-28 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing semiconductor device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010131679A1 (en) * 2009-05-14 2010-11-18 ローム株式会社 Semiconductor device
JP5643752B2 (en) * 2009-05-14 2014-12-17 ローム株式会社 Semiconductor device
JP2015035627A (en) * 2009-05-14 2015-02-19 ローム株式会社 Semiconductor device
US9147666B2 (en) 2009-05-14 2015-09-29 Rohm Co., Ltd. Semiconductor device
US9490200B2 (en) 2009-05-14 2016-11-08 Rohm Co., Ltd. Semiconductor device
JP2015149363A (en) * 2014-02-05 2015-08-20 株式会社デンソー semiconductor module
JP2016207843A (en) * 2015-04-23 2016-12-08 パナソニックＩｐマネジメント株式会社 Semiconductor device
US11996355B2 (en) 2019-10-17 2024-05-28 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing semiconductor device

Also Published As

Publication number Publication date
JPS5856971B2 (en) 1983-12-17

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