JPS5370766A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5370766A
JPS5370766A JP14732076A JP14732076A JPS5370766A JP S5370766 A JPS5370766 A JP S5370766A JP 14732076 A JP14732076 A JP 14732076A JP 14732076 A JP14732076 A JP 14732076A JP S5370766 A JPS5370766 A JP S5370766A
Authority
JP
Japan
Prior art keywords
semiconductor device
lead
electrodes
leads
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14732076A
Other languages
Japanese (ja)
Other versions
JPS606094B2 (en
Inventor
Susumu Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP51147320A priority Critical patent/JPS606094B2/en
Publication of JPS5370766A publication Critical patent/JPS5370766A/en
Publication of JPS606094B2 publication Critical patent/JPS606094B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To achieve considerable automation of external lead bonding by connecting the electrodes of an element to the lead ends of a lead frame, thereafter bending the leads without cutting them.
COPYRIGHT: (C)1978,JPO&Japio
JP51147320A 1976-12-07 1976-12-07 semiconductor equipment Expired JPS606094B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51147320A JPS606094B2 (en) 1976-12-07 1976-12-07 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51147320A JPS606094B2 (en) 1976-12-07 1976-12-07 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5370766A true JPS5370766A (en) 1978-06-23
JPS606094B2 JPS606094B2 (en) 1985-02-15

Family

ID=15427509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51147320A Expired JPS606094B2 (en) 1976-12-07 1976-12-07 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS606094B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63288033A (en) * 1987-05-20 1988-11-25 Matsushita Electric Ind Co Ltd Film carrier
US4860087A (en) * 1986-03-26 1989-08-22 Hitachi, Ltd. Semiconductor device and process for producing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4860087A (en) * 1986-03-26 1989-08-22 Hitachi, Ltd. Semiconductor device and process for producing the same
JPS63288033A (en) * 1987-05-20 1988-11-25 Matsushita Electric Ind Co Ltd Film carrier
JPH0793344B2 (en) * 1987-05-20 1995-10-09 松下電器産業株式会社 Film carrier

Also Published As

Publication number Publication date
JPS606094B2 (en) 1985-02-15

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