JPS5240065A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5240065A
JPS5240065A JP50115625A JP11562575A JPS5240065A JP S5240065 A JPS5240065 A JP S5240065A JP 50115625 A JP50115625 A JP 50115625A JP 11562575 A JP11562575 A JP 11562575A JP S5240065 A JPS5240065 A JP S5240065A
Authority
JP
Japan
Prior art keywords
lead frame
yield
improving
wire bonding
larger size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50115625A
Other languages
Japanese (ja)
Inventor
Michio Tanimoto
Shunei Uematsu
Shunichiro Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50115625A priority Critical patent/JPS5240065A/en
Publication of JPS5240065A publication Critical patent/JPS5240065A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To form the ends of lead frame to a larger size by mutually sliding the ends thereby improving the yield of wire bonding.
COPYRIGHT: (C)1977,JPO&Japio
JP50115625A 1975-09-26 1975-09-26 Lead frame Pending JPS5240065A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50115625A JPS5240065A (en) 1975-09-26 1975-09-26 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50115625A JPS5240065A (en) 1975-09-26 1975-09-26 Lead frame

Publications (1)

Publication Number Publication Date
JPS5240065A true JPS5240065A (en) 1977-03-28

Family

ID=14667272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50115625A Pending JPS5240065A (en) 1975-09-26 1975-09-26 Lead frame

Country Status (1)

Country Link
JP (1) JPS5240065A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108786U (en) * 1978-01-18 1979-07-31

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108786U (en) * 1978-01-18 1979-07-31

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