JPS5338973A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS5338973A JPS5338973A JP11307976A JP11307976A JPS5338973A JP S5338973 A JPS5338973 A JP S5338973A JP 11307976 A JP11307976 A JP 11307976A JP 11307976 A JP11307976 A JP 11307976A JP S5338973 A JPS5338973 A JP S5338973A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- protrusion
- impairing
- pile
- spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: To ensure a pile-up of the lead frames without impairing the element or the connection wire by providing a sufficiently high protrusion on one main surface of the lead frame and using this protrusion as a spacer.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11307976A JPS5338973A (en) | 1976-09-22 | 1976-09-22 | Lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11307976A JPS5338973A (en) | 1976-09-22 | 1976-09-22 | Lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5338973A true JPS5338973A (en) | 1978-04-10 |
Family
ID=14602937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11307976A Pending JPS5338973A (en) | 1976-09-22 | 1976-09-22 | Lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5338973A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58194382A (en) * | 1982-05-08 | 1983-11-12 | Matsushita Electric Ind Co Ltd | Electrode structure for semiconductor device |
JPS59107150U (en) * | 1982-12-31 | 1984-07-19 | ロ−ム株式会社 | Small transistor lead frame |
JPH05131575A (en) * | 1991-11-11 | 1993-05-28 | Nikki Kogyo Kk | Manufacture of paper pallet and apparatus for the same |
-
1976
- 1976-09-22 JP JP11307976A patent/JPS5338973A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58194382A (en) * | 1982-05-08 | 1983-11-12 | Matsushita Electric Ind Co Ltd | Electrode structure for semiconductor device |
JPH0451991B2 (en) * | 1982-05-08 | 1992-08-20 | Matsushita Electric Ind Co Ltd | |
JPS59107150U (en) * | 1982-12-31 | 1984-07-19 | ロ−ム株式会社 | Small transistor lead frame |
JPH05131575A (en) * | 1991-11-11 | 1993-05-28 | Nikki Kogyo Kk | Manufacture of paper pallet and apparatus for the same |
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