JPS5338973A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5338973A
JPS5338973A JP11307976A JP11307976A JPS5338973A JP S5338973 A JPS5338973 A JP S5338973A JP 11307976 A JP11307976 A JP 11307976A JP 11307976 A JP11307976 A JP 11307976A JP S5338973 A JPS5338973 A JP S5338973A
Authority
JP
Japan
Prior art keywords
lead frame
protrusion
impairing
pile
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11307976A
Other languages
Japanese (ja)
Inventor
Usuke Enomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11307976A priority Critical patent/JPS5338973A/en
Publication of JPS5338973A publication Critical patent/JPS5338973A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To ensure a pile-up of the lead frames without impairing the element or the connection wire by providing a sufficiently high protrusion on one main surface of the lead frame and using this protrusion as a spacer.
COPYRIGHT: (C)1978,JPO&Japio
JP11307976A 1976-09-22 1976-09-22 Lead frame Pending JPS5338973A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11307976A JPS5338973A (en) 1976-09-22 1976-09-22 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11307976A JPS5338973A (en) 1976-09-22 1976-09-22 Lead frame

Publications (1)

Publication Number Publication Date
JPS5338973A true JPS5338973A (en) 1978-04-10

Family

ID=14602937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11307976A Pending JPS5338973A (en) 1976-09-22 1976-09-22 Lead frame

Country Status (1)

Country Link
JP (1) JPS5338973A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194382A (en) * 1982-05-08 1983-11-12 Matsushita Electric Ind Co Ltd Electrode structure for semiconductor device
JPS59107150U (en) * 1982-12-31 1984-07-19 ロ−ム株式会社 Small transistor lead frame
JPH05131575A (en) * 1991-11-11 1993-05-28 Nikki Kogyo Kk Manufacture of paper pallet and apparatus for the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194382A (en) * 1982-05-08 1983-11-12 Matsushita Electric Ind Co Ltd Electrode structure for semiconductor device
JPH0451991B2 (en) * 1982-05-08 1992-08-20 Matsushita Electric Ind Co Ltd
JPS59107150U (en) * 1982-12-31 1984-07-19 ロ−ム株式会社 Small transistor lead frame
JPH05131575A (en) * 1991-11-11 1993-05-28 Nikki Kogyo Kk Manufacture of paper pallet and apparatus for the same

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