JPS5314562A - Mounting method of semiconductor pellet to lead frame - Google Patents
Mounting method of semiconductor pellet to lead frameInfo
- Publication number
- JPS5314562A JPS5314562A JP8816876A JP8816876A JPS5314562A JP S5314562 A JPS5314562 A JP S5314562A JP 8816876 A JP8816876 A JP 8816876A JP 8816876 A JP8816876 A JP 8816876A JP S5314562 A JPS5314562 A JP S5314562A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- mounting method
- semiconductor pellet
- pellet
- protruding electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To simplify work and lower cost by providing protruding electrodes at the ends of a lead frame and directly mounting a pellet to these protruding electrodes.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8816876A JPS5314562A (en) | 1976-07-26 | 1976-07-26 | Mounting method of semiconductor pellet to lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8816876A JPS5314562A (en) | 1976-07-26 | 1976-07-26 | Mounting method of semiconductor pellet to lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5314562A true JPS5314562A (en) | 1978-02-09 |
Family
ID=13935376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8816876A Pending JPS5314562A (en) | 1976-07-26 | 1976-07-26 | Mounting method of semiconductor pellet to lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5314562A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0785499B2 (en) * | 1984-03-22 | 1995-09-13 | エスジーエス―トムソン マイクロエレクトロニクス インコーポレイテッド | Integrated circuit lead frame suitable for simultaneous bonding work |
-
1976
- 1976-07-26 JP JP8816876A patent/JPS5314562A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0785499B2 (en) * | 1984-03-22 | 1995-09-13 | エスジーエス―トムソン マイクロエレクトロニクス インコーポレイテッド | Integrated circuit lead frame suitable for simultaneous bonding work |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5375828A (en) | Semiconductor circuit | |
JPS528785A (en) | Semiconductor device electrode structure | |
JPS5314562A (en) | Mounting method of semiconductor pellet to lead frame | |
JPS5334430A (en) | Memory unit | |
JPS53124068A (en) | Lead frame | |
JPS5364470A (en) | Lead frame of semiconductor device | |
JPS5325360A (en) | Production of semiconductor device | |
JPS5338973A (en) | Lead frame | |
JPS5432075A (en) | Semiconductor device | |
JPS5252370A (en) | Fabrication of glass-sealed semiconductor device | |
JPS522281A (en) | Method of making semiconductor devices | |
JPS5315762A (en) | Production of semiconductor device | |
JPS5370766A (en) | Semiconductor device | |
JPS52143186A (en) | Taping device | |
JPS5317274A (en) | Electrode structure of semiconductor element | |
JPS548834A (en) | Semiconductor rectifying device | |
JPS5379461A (en) | Semiconductor device and its manufacturing process | |
JPS53123075A (en) | Group iii-v compound semiconductor device | |
JPS5333057A (en) | Bump type semiconductor device | |
JPS5285470A (en) | Lead frame fixing jig for wire bonding | |
JPS5314563A (en) | Fixing method of semiconductor pellet to lead frame | |
JPS52134395A (en) | Led display device | |
JPS5349949A (en) | Pellet bonding method | |
JPS51135164A (en) | Device of changing the direction of wind | |
JPS5228068A (en) | Dust collector |