JPS5314562A - Mounting method of semiconductor pellet to lead frame - Google Patents

Mounting method of semiconductor pellet to lead frame

Info

Publication number
JPS5314562A
JPS5314562A JP8816876A JP8816876A JPS5314562A JP S5314562 A JPS5314562 A JP S5314562A JP 8816876 A JP8816876 A JP 8816876A JP 8816876 A JP8816876 A JP 8816876A JP S5314562 A JPS5314562 A JP S5314562A
Authority
JP
Japan
Prior art keywords
lead frame
mounting method
semiconductor pellet
pellet
protruding electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8816876A
Other languages
Japanese (ja)
Inventor
Takefumi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8816876A priority Critical patent/JPS5314562A/en
Publication of JPS5314562A publication Critical patent/JPS5314562A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To simplify work and lower cost by providing protruding electrodes at the ends of a lead frame and directly mounting a pellet to these protruding electrodes.
COPYRIGHT: (C)1978,JPO&Japio
JP8816876A 1976-07-26 1976-07-26 Mounting method of semiconductor pellet to lead frame Pending JPS5314562A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8816876A JPS5314562A (en) 1976-07-26 1976-07-26 Mounting method of semiconductor pellet to lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8816876A JPS5314562A (en) 1976-07-26 1976-07-26 Mounting method of semiconductor pellet to lead frame

Publications (1)

Publication Number Publication Date
JPS5314562A true JPS5314562A (en) 1978-02-09

Family

ID=13935376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8816876A Pending JPS5314562A (en) 1976-07-26 1976-07-26 Mounting method of semiconductor pellet to lead frame

Country Status (1)

Country Link
JP (1) JPS5314562A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0785499B2 (en) * 1984-03-22 1995-09-13 エスジーエス―トムソン マイクロエレクトロニクス インコーポレイテッド Integrated circuit lead frame suitable for simultaneous bonding work

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0785499B2 (en) * 1984-03-22 1995-09-13 エスジーエス―トムソン マイクロエレクトロニクス インコーポレイテッド Integrated circuit lead frame suitable for simultaneous bonding work

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