JPS5364470A - Lead frame of semiconductor device - Google Patents

Lead frame of semiconductor device

Info

Publication number
JPS5364470A
JPS5364470A JP14004876A JP14004876A JPS5364470A JP S5364470 A JPS5364470 A JP S5364470A JP 14004876 A JP14004876 A JP 14004876A JP 14004876 A JP14004876 A JP 14004876A JP S5364470 A JPS5364470 A JP S5364470A
Authority
JP
Japan
Prior art keywords
semiconductor device
lead frame
corners
die
bond area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14004876A
Other languages
Japanese (ja)
Other versions
JPS5756779B2 (en
Inventor
Shuichi Osaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14004876A priority Critical patent/JPS5364470A/en
Publication of JPS5364470A publication Critical patent/JPS5364470A/en
Publication of JPS5756779B2 publication Critical patent/JPS5756779B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To facilitate the connection of electrode lead-out openings and lead frames positioned at the corners of a die-bond area so as to oppose to the two sides of the die-bond area forming these corners.
COPYRIGHT: (C)1978,JPO&Japio
JP14004876A 1976-11-19 1976-11-19 Lead frame of semiconductor device Granted JPS5364470A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14004876A JPS5364470A (en) 1976-11-19 1976-11-19 Lead frame of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14004876A JPS5364470A (en) 1976-11-19 1976-11-19 Lead frame of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5364470A true JPS5364470A (en) 1978-06-08
JPS5756779B2 JPS5756779B2 (en) 1982-12-01

Family

ID=15259759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14004876A Granted JPS5364470A (en) 1976-11-19 1976-11-19 Lead frame of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5364470A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5670654A (en) * 1979-11-13 1981-06-12 Nec Corp Semiconductor device
JPS57199239A (en) * 1981-06-02 1982-12-07 Nec Corp Semiconductor integrated circuit device
JPS57195830U (en) * 1981-06-04 1982-12-11

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63270857A (en) * 1987-04-28 1988-11-08 白井実業株式会社 Production of sheet like material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5670654A (en) * 1979-11-13 1981-06-12 Nec Corp Semiconductor device
JPS57199239A (en) * 1981-06-02 1982-12-07 Nec Corp Semiconductor integrated circuit device
JPS57195830U (en) * 1981-06-04 1982-12-11

Also Published As

Publication number Publication date
JPS5756779B2 (en) 1982-12-01

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