JPS5295973A - Manufacture of semiconductor unit with heat sink - Google Patents

Manufacture of semiconductor unit with heat sink

Info

Publication number
JPS5295973A
JPS5295973A JP1227776A JP1227776A JPS5295973A JP S5295973 A JPS5295973 A JP S5295973A JP 1227776 A JP1227776 A JP 1227776A JP 1227776 A JP1227776 A JP 1227776A JP S5295973 A JPS5295973 A JP S5295973A
Authority
JP
Japan
Prior art keywords
manufacture
heat sink
semiconductor unit
junction
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1227776A
Other languages
Japanese (ja)
Inventor
Susumu Okikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1227776A priority Critical patent/JPS5295973A/en
Publication of JPS5295973A publication Critical patent/JPS5295973A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To improve reliability of junction between the heat sink and the lead frame and to reduce processes of manufacture.
COPYRIGHT: (C)1977,JPO&Japio
JP1227776A 1976-02-09 1976-02-09 Manufacture of semiconductor unit with heat sink Pending JPS5295973A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1227776A JPS5295973A (en) 1976-02-09 1976-02-09 Manufacture of semiconductor unit with heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1227776A JPS5295973A (en) 1976-02-09 1976-02-09 Manufacture of semiconductor unit with heat sink

Publications (1)

Publication Number Publication Date
JPS5295973A true JPS5295973A (en) 1977-08-12

Family

ID=11800859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1227776A Pending JPS5295973A (en) 1976-02-09 1976-02-09 Manufacture of semiconductor unit with heat sink

Country Status (1)

Country Link
JP (1) JPS5295973A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60101958A (en) * 1983-11-08 1985-06-06 Rohm Co Ltd Manufacture of diode device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60101958A (en) * 1983-11-08 1985-06-06 Rohm Co Ltd Manufacture of diode device

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