JPS5345973A - Resin-sealing-type semiconductor device - Google Patents
Resin-sealing-type semiconductor deviceInfo
- Publication number
- JPS5345973A JPS5345973A JP12054276A JP12054276A JPS5345973A JP S5345973 A JPS5345973 A JP S5345973A JP 12054276 A JP12054276 A JP 12054276A JP 12054276 A JP12054276 A JP 12054276A JP S5345973 A JPS5345973 A JP S5345973A
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- resin
- semiconductor device
- type semiconductor
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To obtain a resin-sealing-type high power device which is excellently heat-radiative by performing the insulation and heat radiation through a simple constitution.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12054276A JPS5345973A (en) | 1976-10-06 | 1976-10-06 | Resin-sealing-type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12054276A JPS5345973A (en) | 1976-10-06 | 1976-10-06 | Resin-sealing-type semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5345973A true JPS5345973A (en) | 1978-04-25 |
JPS569013B2 JPS569013B2 (en) | 1981-02-26 |
Family
ID=14788862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12054276A Granted JPS5345973A (en) | 1976-10-06 | 1976-10-06 | Resin-sealing-type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5345973A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5555550A (en) * | 1978-10-18 | 1980-04-23 | Nec Kyushu Ltd | Semiconductor device |
JPS60195878U (en) * | 1984-06-05 | 1985-12-27 | 三菱電機株式会社 | Drainage system for elevator cooling equipment |
-
1976
- 1976-10-06 JP JP12054276A patent/JPS5345973A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5555550A (en) * | 1978-10-18 | 1980-04-23 | Nec Kyushu Ltd | Semiconductor device |
JPS6130741B2 (en) * | 1978-10-18 | 1986-07-15 | Kyushu Nippon Electric | |
JPS60195878U (en) * | 1984-06-05 | 1985-12-27 | 三菱電機株式会社 | Drainage system for elevator cooling equipment |
Also Published As
Publication number | Publication date |
---|---|
JPS569013B2 (en) | 1981-02-26 |
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