JPS57199239A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS57199239A
JPS57199239A JP56084770A JP8477081A JPS57199239A JP S57199239 A JPS57199239 A JP S57199239A JP 56084770 A JP56084770 A JP 56084770A JP 8477081 A JP8477081 A JP 8477081A JP S57199239 A JPS57199239 A JP S57199239A
Authority
JP
Japan
Prior art keywords
pads
integrated circuit
semiconductor integrated
circuit device
function
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56084770A
Other languages
Japanese (ja)
Inventor
Shigenori Nagara
Tetsuro Hirayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56084770A priority Critical patent/JPS57199239A/en
Publication of JPS57199239A publication Critical patent/JPS57199239A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To avoid a crossing of wires when a function is changed by changing pairs of wire-bonded internal pads by providing a plurality of internal pads for the identical signal. CONSTITUTION:Functional blocks A, B, C and D and pads PA1, PA2, PB1, PC1, and PD1 are provided in a semiconductor integrated circuit chip 1. One function is obtained by connecting the pads PA1 and PC1 and the pads PB1 and PD1. Another function is obtained by connecting the pads PA2 and PD1 and the pads PB1 and PC1. Two pads (PA1, PA2) are provided for connecting to the functional block A, so that the crossing of wires is avoided even if the pair of internal pads connected each other is changed over.
JP56084770A 1981-06-02 1981-06-02 Semiconductor integrated circuit device Pending JPS57199239A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56084770A JPS57199239A (en) 1981-06-02 1981-06-02 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56084770A JPS57199239A (en) 1981-06-02 1981-06-02 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS57199239A true JPS57199239A (en) 1982-12-07

Family

ID=13839910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56084770A Pending JPS57199239A (en) 1981-06-02 1981-06-02 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS57199239A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5364470A (en) * 1976-11-19 1978-06-08 Mitsubishi Electric Corp Lead frame of semiconductor device
JPS5492190A (en) * 1977-12-29 1979-07-21 Fujitsu Ltd Integrated circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5364470A (en) * 1976-11-19 1978-06-08 Mitsubishi Electric Corp Lead frame of semiconductor device
JPS5492190A (en) * 1977-12-29 1979-07-21 Fujitsu Ltd Integrated circuit

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