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JPS5417666A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5417666A
JPS5417666A JP8223977A JP8223977A JPS5417666A JP S5417666 A JPS5417666 A JP S5417666A JP 8223977 A JP8223977 A JP 8223977A JP 8223977 A JP8223977 A JP 8223977A JP S5417666 A JPS5417666 A JP S5417666A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
lead
frame
semiconductor
purpose
avoid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8223977A
Inventor
Manabu Bonshihara
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To avoid a mutual contact, and to improve the integration of a lead frame by providing arc-shaped, circular and square cushions in the middle part of the lead connected to the electrode of a semiconductor element while shifting them mutually.
COPYRIGHT: (C)1979,JPO&Japio
JP8223977A 1977-07-08 1977-07-08 Lead frame Pending JPS5417666A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8223977A JPS5417666A (en) 1977-07-08 1977-07-08 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8223977A JPS5417666A (en) 1977-07-08 1977-07-08 Lead frame

Publications (1)

Publication Number Publication Date
JPS5417666A true true JPS5417666A (en) 1979-02-09

Family

ID=13768851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8223977A Pending JPS5417666A (en) 1977-07-08 1977-07-08 Lead frame

Country Status (1)

Country Link
JP (1) JPS5417666A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5796561A (en) * 1980-12-08 1982-06-15 Nec Corp Lead for connection of semiconductor device
JPS6126233A (en) * 1984-07-13 1986-02-05 Matsushita Electric Ind Co Ltd Semiconductor device
JPH01270241A (en) * 1988-04-21 1989-10-27 Fujitsu Ltd Semiconductor device
JPH02205333A (en) * 1989-02-03 1990-08-15 Hitachi Cable Ltd Tape carrier for tab
US5117275A (en) * 1990-10-24 1992-05-26 International Business Machines Corporation Electronic substrate multiple location conductor attachment technology
US5229328A (en) * 1990-10-24 1993-07-20 International Business Machines Corporation Method for bonding dielectric mounted conductors to semiconductor chip contact pads
US5233221A (en) * 1990-10-24 1993-08-03 International Business Machines Corporation Electronic substrate multiple location conductor attachment technology

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5796561A (en) * 1980-12-08 1982-06-15 Nec Corp Lead for connection of semiconductor device
JPS6132821B2 (en) * 1980-12-08 1986-07-29 Nippon Electric Co
JPS6126233A (en) * 1984-07-13 1986-02-05 Matsushita Electric Ind Co Ltd Semiconductor device
JPH01270241A (en) * 1988-04-21 1989-10-27 Fujitsu Ltd Semiconductor device
JPH02205333A (en) * 1989-02-03 1990-08-15 Hitachi Cable Ltd Tape carrier for tab
US5117275A (en) * 1990-10-24 1992-05-26 International Business Machines Corporation Electronic substrate multiple location conductor attachment technology
US5229328A (en) * 1990-10-24 1993-07-20 International Business Machines Corporation Method for bonding dielectric mounted conductors to semiconductor chip contact pads
US5233221A (en) * 1990-10-24 1993-08-03 International Business Machines Corporation Electronic substrate multiple location conductor attachment technology

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