JPS5216166A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5216166A
JPS5216166A JP50092773A JP9277375A JPS5216166A JP S5216166 A JPS5216166 A JP S5216166A JP 50092773 A JP50092773 A JP 50092773A JP 9277375 A JP9277375 A JP 9277375A JP S5216166 A JPS5216166 A JP S5216166A
Authority
JP
Japan
Prior art keywords
semiconductor
connection
thinning
package
projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50092773A
Other languages
Japanese (ja)
Other versions
JPS5712295B2 (en
Inventor
Masaharu Noyori
Isamu Kitahiro
Hiroaki Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP9277375A priority Critical patent/JPS5712295B2/ja
Publication of JPS5216166A publication Critical patent/JPS5216166A/en
Publication of JPS5712295B2 publication Critical patent/JPS5712295B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73267Layer and HDI connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92Specific sequence of method steps
    • H01L2224/921Connecting a surface with connectors of different types
    • H01L2224/9212Sequential connecting processes
    • H01L2224/92142Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92144Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/1515Shape
    • H01L2924/15153Shape the die mounting substrate comprising a recess for hosting the device

Abstract

PURPOSE: To perform the electric connection easily without forming a projection at the connection of the electrode of the semiconductor element, and to make the thinning of the package possible.
COPYRIGHT: (C)1977,JPO&Japio
JP9277375A 1975-07-29 1975-07-29 Expired JPS5712295B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9277375A JPS5712295B2 (en) 1975-07-29 1975-07-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9277375A JPS5712295B2 (en) 1975-07-29 1975-07-29

Publications (2)

Publication Number Publication Date
JPS5216166A true JPS5216166A (en) 1977-02-07
JPS5712295B2 JPS5712295B2 (en) 1982-03-10

Family

ID=14063727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9277375A Expired JPS5712295B2 (en) 1975-07-29 1975-07-29

Country Status (1)

Country Link
JP (1) JPS5712295B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139972A (en) * 1977-05-13 1978-12-06 Matsushita Electric Ind Co Ltd Production of semiconductor device
JPS5630782A (en) * 1979-08-20 1981-03-27 Matsushita Electric Ind Co Ltd Electronic circuit device and method of manufacturing same
US5452182A (en) * 1990-04-05 1995-09-19 Martin Marietta Corporation Flexible high density interconnect structure and flexibly interconnected system

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59180798U (en) * 1983-05-18 1984-12-03

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139972A (en) * 1977-05-13 1978-12-06 Matsushita Electric Ind Co Ltd Production of semiconductor device
JPS5630782A (en) * 1979-08-20 1981-03-27 Matsushita Electric Ind Co Ltd Electronic circuit device and method of manufacturing same
JPS6367358B2 (en) * 1979-08-20 1988-12-26 Matsushita Electric Ind Co Ltd
US5452182A (en) * 1990-04-05 1995-09-19 Martin Marietta Corporation Flexible high density interconnect structure and flexibly interconnected system

Also Published As

Publication number Publication date
JPS5712295B2 (en) 1982-03-10

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