JPS5384679A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS5384679A JPS5384679A JP16064376A JP16064376A JPS5384679A JP S5384679 A JPS5384679 A JP S5384679A JP 16064376 A JP16064376 A JP 16064376A JP 16064376 A JP16064376 A JP 16064376A JP S5384679 A JPS5384679 A JP S5384679A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- contacting
- lead frame
- improve productivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
PURPOSE: To improve productivity by contacting and connecting the opposing leads of a lead frame to plural bump electrodes.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16064376A JPS5384679A (en) | 1976-12-29 | 1976-12-29 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16064376A JPS5384679A (en) | 1976-12-29 | 1976-12-29 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5384679A true JPS5384679A (en) | 1978-07-26 |
Family
ID=15719360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16064376A Pending JPS5384679A (en) | 1976-12-29 | 1976-12-29 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5384679A (en) |
-
1976
- 1976-12-29 JP JP16064376A patent/JPS5384679A/en active Pending
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