JPS52142484A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS52142484A JPS52142484A JP5951976A JP5951976A JPS52142484A JP S52142484 A JPS52142484 A JP S52142484A JP 5951976 A JP5951976 A JP 5951976A JP 5951976 A JP5951976 A JP 5951976A JP S52142484 A JPS52142484 A JP S52142484A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- pellets
- owing
- contacting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: To prevent shortcircuiting owing to electrode flow on pellets by contacting and bonding leads to semiconductor pellets by way of an insulation part piece.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5951976A JPS52142484A (en) | 1976-05-21 | 1976-05-21 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5951976A JPS52142484A (en) | 1976-05-21 | 1976-05-21 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52142484A true JPS52142484A (en) | 1977-11-28 |
Family
ID=13115582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5951976A Pending JPS52142484A (en) | 1976-05-21 | 1976-05-21 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52142484A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63178537A (en) * | 1987-01-20 | 1988-07-22 | Nec Corp | Lead frame |
-
1976
- 1976-05-21 JP JP5951976A patent/JPS52142484A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63178537A (en) * | 1987-01-20 | 1988-07-22 | Nec Corp | Lead frame |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5239378A (en) | Silicon-gated mos type semiconductor device | |
JPS5380966A (en) | Manufacture of electrode fdr semiconductor device | |
JPS5279658A (en) | Semiconductor device | |
JPS52142484A (en) | Production of semiconductor device | |
JPS5228868A (en) | Semiconductor device | |
JPS5315762A (en) | Production of semiconductor device | |
JPS5269275A (en) | Transistor | |
JPS5378768A (en) | Wire bonding method of semiconductor element | |
JPS5279659A (en) | Semiconductor device | |
JPS5362471A (en) | Semiconductor device | |
JPS52153383A (en) | Preparation of semiconductor device | |
JPS51118965A (en) | Insulation film of semiconductor device | |
JPS5211772A (en) | Semiconductor device | |
JPS51112266A (en) | Semiconductor device production method | |
JPS533071A (en) | Semiconductor device | |
JPS5360176A (en) | Semiconductor device | |
JPS5379461A (en) | Semiconductor device and its manufacturing process | |
JPS5352365A (en) | Semiconductor device | |
JPS5289469A (en) | Production of semiconductor device | |
JPS5248470A (en) | Method of bonding semiconductor chips | |
JPS5295973A (en) | Manufacture of semiconductor unit with heat sink | |
JPS52178A (en) | Pnp transistor | |
JPS5235581A (en) | Manufacturing process of semiconductor device | |
JPS51132767A (en) | Formation method of semiconductor device | |
JPS5283166A (en) | Semiconductor device and its production |