JPS5352365A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5352365A
JPS5352365A JP12763876A JP12763876A JPS5352365A JP S5352365 A JPS5352365 A JP S5352365A JP 12763876 A JP12763876 A JP 12763876A JP 12763876 A JP12763876 A JP 12763876A JP S5352365 A JPS5352365 A JP S5352365A
Authority
JP
Japan
Prior art keywords
semiconductor device
ics
bonding
lower cost
tape carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12763876A
Other languages
Japanese (ja)
Inventor
Koichi Oguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP12763876A priority Critical patent/JPS5352365A/en
Publication of JPS5352365A publication Critical patent/JPS5352365A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Abstract

PURPOSE: Lower cost and higher volume production of bonding process of ICs are achieved by performing tape carrier bonding of ICs not formed with bump electrodes.
COPYRIGHT: (C)1978,JPO&Japio
JP12763876A 1976-10-23 1976-10-23 Semiconductor device Pending JPS5352365A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12763876A JPS5352365A (en) 1976-10-23 1976-10-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12763876A JPS5352365A (en) 1976-10-23 1976-10-23 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5352365A true JPS5352365A (en) 1978-05-12

Family

ID=14965036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12763876A Pending JPS5352365A (en) 1976-10-23 1976-10-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5352365A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02119153A (en) * 1988-06-01 1990-05-07 Hewlett Packard Co <Hp> Bonding method for integrated circuit

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5348463A (en) * 1976-10-14 1978-05-01 Hamasawa Kogyo:Kk Semiconductor integrated circuit support

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5348463A (en) * 1976-10-14 1978-05-01 Hamasawa Kogyo:Kk Semiconductor integrated circuit support

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02119153A (en) * 1988-06-01 1990-05-07 Hewlett Packard Co <Hp> Bonding method for integrated circuit

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