JPS5313874A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5313874A
JPS5313874A JP8856976A JP8856976A JPS5313874A JP S5313874 A JPS5313874 A JP S5313874A JP 8856976 A JP8856976 A JP 8856976A JP 8856976 A JP8856976 A JP 8856976A JP S5313874 A JPS5313874 A JP S5313874A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
film
providing
facilitation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8856976A
Other languages
Japanese (ja)
Inventor
Shigehiro Nakano
Akiyoshi Tanimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP8856976A priority Critical patent/JPS5313874A/en
Publication of JPS5313874A publication Critical patent/JPS5313874A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To stably hold conductor ends to become lead wires and achieve the facilitation of work by providing hole groups on the outside of the chip providing region of a film and depositing conductor patterns on the film.
COPYRIGHT: (C)1978,JPO&Japio
JP8856976A 1976-07-23 1976-07-23 Production of semiconductor device Pending JPS5313874A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8856976A JPS5313874A (en) 1976-07-23 1976-07-23 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8856976A JPS5313874A (en) 1976-07-23 1976-07-23 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5313874A true JPS5313874A (en) 1978-02-07

Family

ID=13946485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8856976A Pending JPS5313874A (en) 1976-07-23 1976-07-23 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5313874A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4994895A (en) * 1988-07-11 1991-02-19 Fujitsu Limited Hybrid integrated circuit package structure
US5264730A (en) * 1990-01-06 1993-11-23 Fujitsu Limited Resin mold package structure of integrated circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4994895A (en) * 1988-07-11 1991-02-19 Fujitsu Limited Hybrid integrated circuit package structure
US5264730A (en) * 1990-01-06 1993-11-23 Fujitsu Limited Resin mold package structure of integrated circuit

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