JPS5313874A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS5313874A JPS5313874A JP8856976A JP8856976A JPS5313874A JP S5313874 A JPS5313874 A JP S5313874A JP 8856976 A JP8856976 A JP 8856976A JP 8856976 A JP8856976 A JP 8856976A JP S5313874 A JPS5313874 A JP S5313874A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- film
- providing
- facilitation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: To stably hold conductor ends to become lead wires and achieve the facilitation of work by providing hole groups on the outside of the chip providing region of a film and depositing conductor patterns on the film.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8856976A JPS5313874A (en) | 1976-07-23 | 1976-07-23 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8856976A JPS5313874A (en) | 1976-07-23 | 1976-07-23 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5313874A true JPS5313874A (en) | 1978-02-07 |
Family
ID=13946485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8856976A Pending JPS5313874A (en) | 1976-07-23 | 1976-07-23 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5313874A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4994895A (en) * | 1988-07-11 | 1991-02-19 | Fujitsu Limited | Hybrid integrated circuit package structure |
US5264730A (en) * | 1990-01-06 | 1993-11-23 | Fujitsu Limited | Resin mold package structure of integrated circuit |
-
1976
- 1976-07-23 JP JP8856976A patent/JPS5313874A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4994895A (en) * | 1988-07-11 | 1991-02-19 | Fujitsu Limited | Hybrid integrated circuit package structure |
US5264730A (en) * | 1990-01-06 | 1993-11-23 | Fujitsu Limited | Resin mold package structure of integrated circuit |
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