JPS51127678A - Semiconductor device and its manufacturing method - Google Patents

Semiconductor device and its manufacturing method

Info

Publication number
JPS51127678A
JPS51127678A JP50051383A JP5138375A JPS51127678A JP S51127678 A JPS51127678 A JP S51127678A JP 50051383 A JP50051383 A JP 50051383A JP 5138375 A JP5138375 A JP 5138375A JP S51127678 A JPS51127678 A JP S51127678A
Authority
JP
Japan
Prior art keywords
manufacturing
semiconductor device
conductor
secure
built
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50051383A
Other languages
Japanese (ja)
Inventor
Wataru Nozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50051383A priority Critical patent/JPS51127678A/en
Publication of JPS51127678A publication Critical patent/JPS51127678A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To secure a steady connection and improve yield by directly attaching the semiconductor element to the conductor which is built on the polyamide film without any opening.
COPYRIGHT: (C)1976,JPO&Japio
JP50051383A 1975-04-30 1975-04-30 Semiconductor device and its manufacturing method Pending JPS51127678A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50051383A JPS51127678A (en) 1975-04-30 1975-04-30 Semiconductor device and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50051383A JPS51127678A (en) 1975-04-30 1975-04-30 Semiconductor device and its manufacturing method

Publications (1)

Publication Number Publication Date
JPS51127678A true JPS51127678A (en) 1976-11-06

Family

ID=12885413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50051383A Pending JPS51127678A (en) 1975-04-30 1975-04-30 Semiconductor device and its manufacturing method

Country Status (1)

Country Link
JP (1) JPS51127678A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58166753A (en) * 1982-03-27 1983-10-01 Toshiba Corp Semiconductor device
JPS61164037U (en) * 1985-03-08 1986-10-11
JPS6242540A (en) * 1985-08-20 1987-02-24 Fujitsu Ltd Manufacture of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58166753A (en) * 1982-03-27 1983-10-01 Toshiba Corp Semiconductor device
JPS61164037U (en) * 1985-03-08 1986-10-11
JPS6242540A (en) * 1985-08-20 1987-02-24 Fujitsu Ltd Manufacture of semiconductor device

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