JPS5255871A - Production of semiconductor - Google Patents

Production of semiconductor

Info

Publication number
JPS5255871A
JPS5255871A JP13255875A JP13255875A JPS5255871A JP S5255871 A JPS5255871 A JP S5255871A JP 13255875 A JP13255875 A JP 13255875A JP 13255875 A JP13255875 A JP 13255875A JP S5255871 A JPS5255871 A JP S5255871A
Authority
JP
Japan
Prior art keywords
semiconductor
production
wafers
pefform
damaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13255875A
Other languages
Japanese (ja)
Other versions
JPS5640979B2 (en
Inventor
Masao Kachi
Hiroshi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP13255875A priority Critical patent/JPS5255871A/en
Publication of JPS5255871A publication Critical patent/JPS5255871A/en
Publication of JPS5640979B2 publication Critical patent/JPS5640979B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To pefform aligning of wafers during production of semiconductor device easily without damaging by the sensors on a screen and the streets formed on semiconductor wafers.
COPYRIGHT: (C)1977,JPO&Japio
JP13255875A 1975-11-04 1975-11-04 Production of semiconductor Granted JPS5255871A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13255875A JPS5255871A (en) 1975-11-04 1975-11-04 Production of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13255875A JPS5255871A (en) 1975-11-04 1975-11-04 Production of semiconductor

Publications (2)

Publication Number Publication Date
JPS5255871A true JPS5255871A (en) 1977-05-07
JPS5640979B2 JPS5640979B2 (en) 1981-09-25

Family

ID=15084089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13255875A Granted JPS5255871A (en) 1975-11-04 1975-11-04 Production of semiconductor

Country Status (1)

Country Link
JP (1) JPS5255871A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5553439A (en) * 1978-10-16 1980-04-18 Fujitsu Ltd Dicing treatment method
JPS55140243A (en) * 1979-04-20 1980-11-01 Hitachi Ltd Dicing device
JPS5758332A (en) * 1980-09-24 1982-04-08 Fujitsu Ltd Manufacture of semiconductor device
JPS61212037A (en) * 1985-03-18 1986-09-20 Hitachi Electronics Eng Co Ltd Coordinate value reading process
JPS63128907A (en) * 1986-11-19 1988-06-01 株式会社東京精密 Grooving control method of dicing device
JPH0569437A (en) * 1991-05-14 1993-03-23 Tokyo Seimitsu Co Ltd Grooving control device of dicing apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5684989U (en) * 1979-12-06 1981-07-08

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5166780A (en) * 1974-12-06 1976-06-09 Nippon Electric Co Handotaiperetsutono ichiawasehoho oyobi sochi

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5166780A (en) * 1974-12-06 1976-06-09 Nippon Electric Co Handotaiperetsutono ichiawasehoho oyobi sochi

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5553439A (en) * 1978-10-16 1980-04-18 Fujitsu Ltd Dicing treatment method
JPS55140243A (en) * 1979-04-20 1980-11-01 Hitachi Ltd Dicing device
JPS6152573B2 (en) * 1979-04-20 1986-11-13 Hitachi Ltd
JPS5758332A (en) * 1980-09-24 1982-04-08 Fujitsu Ltd Manufacture of semiconductor device
JPS61212037A (en) * 1985-03-18 1986-09-20 Hitachi Electronics Eng Co Ltd Coordinate value reading process
JPS63128907A (en) * 1986-11-19 1988-06-01 株式会社東京精密 Grooving control method of dicing device
JP2530827B2 (en) * 1986-11-19 1996-09-04 株式会社東京精密 Grooving control method for dicing machine
JPH0569437A (en) * 1991-05-14 1993-03-23 Tokyo Seimitsu Co Ltd Grooving control device of dicing apparatus
JP2501970B2 (en) * 1991-05-14 1996-05-29 株式会社東京精密 Grooving control device for dicing machine

Also Published As

Publication number Publication date
JPS5640979B2 (en) 1981-09-25

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