JPS5279654A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5279654A
JPS5279654A JP15615175A JP15615175A JPS5279654A JP S5279654 A JPS5279654 A JP S5279654A JP 15615175 A JP15615175 A JP 15615175A JP 15615175 A JP15615175 A JP 15615175A JP S5279654 A JPS5279654 A JP S5279654A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
substrate
take out
predetermined thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15615175A
Other languages
Japanese (ja)
Inventor
Masanobu Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15615175A priority Critical patent/JPS5279654A/en
Publication of JPS5279654A publication Critical patent/JPS5279654A/en
Pending legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To take out semiconductor elements of a predetermined thickness by accurately isolating from a substrate.
COPYRIGHT: (C)1977,JPO&Japio
JP15615175A 1975-12-25 1975-12-25 Production of semiconductor device Pending JPS5279654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15615175A JPS5279654A (en) 1975-12-25 1975-12-25 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15615175A JPS5279654A (en) 1975-12-25 1975-12-25 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5279654A true JPS5279654A (en) 1977-07-04

Family

ID=15621446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15615175A Pending JPS5279654A (en) 1975-12-25 1975-12-25 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5279654A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001176822A (en) * 1999-12-16 2001-06-29 Disco Abrasive Syst Ltd Method for dividing semiconductor wafer
US6730579B1 (en) 1999-02-05 2004-05-04 Sharp Kabushiki Kaisha Method of manufacturing a semiconductor dice by partially dicing the substrate and subsequent chemical etching
JP2005504445A (en) * 2001-10-01 2005-02-10 エグシル テクノロジー リミテッド Processing of substrates, especially semiconductor wafers
JP2006261515A (en) * 2005-03-18 2006-09-28 Fujitsu Ltd Wet etching method, micro movable element and method for manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4939310A (en) * 1972-08-14 1974-04-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4939310A (en) * 1972-08-14 1974-04-12

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6730579B1 (en) 1999-02-05 2004-05-04 Sharp Kabushiki Kaisha Method of manufacturing a semiconductor dice by partially dicing the substrate and subsequent chemical etching
JP2001176822A (en) * 1999-12-16 2001-06-29 Disco Abrasive Syst Ltd Method for dividing semiconductor wafer
JP2005504445A (en) * 2001-10-01 2005-02-10 エグシル テクノロジー リミテッド Processing of substrates, especially semiconductor wafers
JP2006261515A (en) * 2005-03-18 2006-09-28 Fujitsu Ltd Wet etching method, micro movable element and method for manufacturing the same
JP4504237B2 (en) * 2005-03-18 2010-07-14 富士通株式会社 Wet etching method, micro movable element manufacturing method, and micro movable element
US7851976B2 (en) 2005-03-18 2010-12-14 Fujitsu Limited Micro movable device and method of making the same using wet etching

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