JPS5279654A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS5279654A JPS5279654A JP15615175A JP15615175A JPS5279654A JP S5279654 A JPS5279654 A JP S5279654A JP 15615175 A JP15615175 A JP 15615175A JP 15615175 A JP15615175 A JP 15615175A JP S5279654 A JPS5279654 A JP S5279654A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- substrate
- take out
- predetermined thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Weting (AREA)
- Dicing (AREA)
Abstract
PURPOSE: To take out semiconductor elements of a predetermined thickness by accurately isolating from a substrate.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15615175A JPS5279654A (en) | 1975-12-25 | 1975-12-25 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15615175A JPS5279654A (en) | 1975-12-25 | 1975-12-25 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5279654A true JPS5279654A (en) | 1977-07-04 |
Family
ID=15621446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15615175A Pending JPS5279654A (en) | 1975-12-25 | 1975-12-25 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5279654A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001176822A (en) * | 1999-12-16 | 2001-06-29 | Disco Abrasive Syst Ltd | Method for dividing semiconductor wafer |
US6730579B1 (en) | 1999-02-05 | 2004-05-04 | Sharp Kabushiki Kaisha | Method of manufacturing a semiconductor dice by partially dicing the substrate and subsequent chemical etching |
JP2005504445A (en) * | 2001-10-01 | 2005-02-10 | エグシル テクノロジー リミテッド | Processing of substrates, especially semiconductor wafers |
JP2006261515A (en) * | 2005-03-18 | 2006-09-28 | Fujitsu Ltd | Wet etching method, micro movable element and method for manufacturing the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4939310A (en) * | 1972-08-14 | 1974-04-12 |
-
1975
- 1975-12-25 JP JP15615175A patent/JPS5279654A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4939310A (en) * | 1972-08-14 | 1974-04-12 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6730579B1 (en) | 1999-02-05 | 2004-05-04 | Sharp Kabushiki Kaisha | Method of manufacturing a semiconductor dice by partially dicing the substrate and subsequent chemical etching |
JP2001176822A (en) * | 1999-12-16 | 2001-06-29 | Disco Abrasive Syst Ltd | Method for dividing semiconductor wafer |
JP2005504445A (en) * | 2001-10-01 | 2005-02-10 | エグシル テクノロジー リミテッド | Processing of substrates, especially semiconductor wafers |
JP2006261515A (en) * | 2005-03-18 | 2006-09-28 | Fujitsu Ltd | Wet etching method, micro movable element and method for manufacturing the same |
JP4504237B2 (en) * | 2005-03-18 | 2010-07-14 | 富士通株式会社 | Wet etching method, micro movable element manufacturing method, and micro movable element |
US7851976B2 (en) | 2005-03-18 | 2010-12-14 | Fujitsu Limited | Micro movable device and method of making the same using wet etching |
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