JPS5758332A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5758332A
JPS5758332A JP13257080A JP13257080A JPS5758332A JP S5758332 A JPS5758332 A JP S5758332A JP 13257080 A JP13257080 A JP 13257080A JP 13257080 A JP13257080 A JP 13257080A JP S5758332 A JPS5758332 A JP S5758332A
Authority
JP
Japan
Prior art keywords
dicing
substrate
lines
scribed
photodetector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13257080A
Other languages
Japanese (ja)
Inventor
Muneo Hokozaki
Noboru Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13257080A priority Critical patent/JPS5758332A/en
Publication of JPS5758332A publication Critical patent/JPS5758332A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

PURPOSE:To enable the manufacture of a semiconductor chip having different size inexpensively by selectively varying the interval of dicing lines and dicing along the dicing lines. CONSTITUTION:Dicing lines of different interval are selectively formed on a semiconductor substrate 1 to form a region of semiconductor chips having different sizes. A photodetector 2 in which many photocells are aligned is faced on the substrate 1, the relfected light on the substrate 1 is measured by the photodetector 2 while the dicing lines x1 is scribed, for example, by a diamond tool 3, and the next dicing line x2 is automatically recognized. In this manner, the next dicing line is sequentially recognized, and is scribed by varying the feeding amount of the tool 3. Such an automatic recognition can be similarly performed in the dicing even by a laser, a dicing saw or the like.
JP13257080A 1980-09-24 1980-09-24 Manufacture of semiconductor device Pending JPS5758332A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13257080A JPS5758332A (en) 1980-09-24 1980-09-24 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13257080A JPS5758332A (en) 1980-09-24 1980-09-24 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5758332A true JPS5758332A (en) 1982-04-08

Family

ID=15084392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13257080A Pending JPS5758332A (en) 1980-09-24 1980-09-24 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5758332A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103634A (en) * 1983-11-11 1985-06-07 Hitachi Electronics Eng Co Ltd Automatic wafer prober device
US4904610A (en) * 1988-01-27 1990-02-27 General Instrument Corporation Wafer level process for fabricating passivated semiconductor devices
US7717206B2 (en) 2003-04-02 2010-05-18 Yamaha Hatsudoki Kabushiki Kaisha Air intake system for off-road vehicle

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4827491A (en) * 1971-08-12 1973-04-11
JPS4947976A (en) * 1972-08-30 1974-05-09
JPS5255871A (en) * 1975-11-04 1977-05-07 Nec Home Electronics Ltd Production of semiconductor
JPS5322386A (en) * 1976-08-12 1978-03-01 Sanyo Electric Co Ltd Polarity identifying method of light emitting diode pellets
JPS543465A (en) * 1977-06-09 1979-01-11 Toshiba Corp Scribing device for wafer
JPS5474678A (en) * 1977-11-28 1979-06-14 Hitachi Ltd Detection method of chip location on semiconductor wafer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4827491A (en) * 1971-08-12 1973-04-11
JPS4947976A (en) * 1972-08-30 1974-05-09
JPS5255871A (en) * 1975-11-04 1977-05-07 Nec Home Electronics Ltd Production of semiconductor
JPS5322386A (en) * 1976-08-12 1978-03-01 Sanyo Electric Co Ltd Polarity identifying method of light emitting diode pellets
JPS543465A (en) * 1977-06-09 1979-01-11 Toshiba Corp Scribing device for wafer
JPS5474678A (en) * 1977-11-28 1979-06-14 Hitachi Ltd Detection method of chip location on semiconductor wafer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103634A (en) * 1983-11-11 1985-06-07 Hitachi Electronics Eng Co Ltd Automatic wafer prober device
US4904610A (en) * 1988-01-27 1990-02-27 General Instrument Corporation Wafer level process for fabricating passivated semiconductor devices
US7717206B2 (en) 2003-04-02 2010-05-18 Yamaha Hatsudoki Kabushiki Kaisha Air intake system for off-road vehicle

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