JPS6453488A - Manufacture of light emitting semiconductor device - Google Patents

Manufacture of light emitting semiconductor device

Info

Publication number
JPS6453488A
JPS6453488A JP21091287A JP21091287A JPS6453488A JP S6453488 A JPS6453488 A JP S6453488A JP 21091287 A JP21091287 A JP 21091287A JP 21091287 A JP21091287 A JP 21091287A JP S6453488 A JPS6453488 A JP S6453488A
Authority
JP
Japan
Prior art keywords
laser
chips
specified
manufacture
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21091287A
Other languages
Japanese (ja)
Inventor
Hiroshi Matsubara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP21091287A priority Critical patent/JPS6453488A/en
Publication of JPS6453488A publication Critical patent/JPS6453488A/en
Pending legal-status Critical Current

Links

Landscapes

  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To lay out each semiconductor chip at a certain mutual positions with a high accuracy without generating thermal mutual operation by fixing a plurality of semiconductor chips which are connected to each other on a fixed base and then removing the connection parts. CONSTITUTION:Laser chips 8a-8c are formed at specified mutual positions through separation grooves 9, 9 beforehand. Then, this laser array 1 is placed at a specified position of a fixed base 2 and then is sealed with a solder 12. After that, joining parts 13, 13 remaining on a substrate 7 of sealed laser array 1 are removed by the dicing saw machining and the laser chips 8a-8c are separated from each other. Since the laser chips 8a-8c are separated from each other in this kind of laser array 1, no thermal mutual operation is generated among them and the laser chips 8a-8c are laid out at specified mutual positions with improved accuracy.
JP21091287A 1987-08-24 1987-08-24 Manufacture of light emitting semiconductor device Pending JPS6453488A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21091287A JPS6453488A (en) 1987-08-24 1987-08-24 Manufacture of light emitting semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21091287A JPS6453488A (en) 1987-08-24 1987-08-24 Manufacture of light emitting semiconductor device

Publications (1)

Publication Number Publication Date
JPS6453488A true JPS6453488A (en) 1989-03-01

Family

ID=16597126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21091287A Pending JPS6453488A (en) 1987-08-24 1987-08-24 Manufacture of light emitting semiconductor device

Country Status (1)

Country Link
JP (1) JPS6453488A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5638393A (en) * 1994-12-07 1997-06-10 Xerox Corporation Nonmonolithic multiple laser source arrays
US5805630A (en) * 1993-07-12 1998-09-08 U.S. Philips Corporation Optoelectronic semiconductor device with an array of semiconductor diode lasers and method of manufacturing such a device
JP2003243760A (en) * 2002-02-18 2003-08-29 Ricoh Co Ltd Light source module, light source device, optical scanner, and image forming device
JP2006054277A (en) * 2004-08-11 2006-02-23 Sony Corp Semiconductor laser light emitter and method for manufacturing semiconductor laser light emitter
JP2008169811A (en) * 2007-01-15 2008-07-24 Calsonic Compressor Inc Gas compressor
JP2008235750A (en) * 2007-03-23 2008-10-02 Seiko Epson Corp Laser element, method of manufacturing laser light source, laser light source, illuminating apparatus, monitoring apparatus, and projector

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5805630A (en) * 1993-07-12 1998-09-08 U.S. Philips Corporation Optoelectronic semiconductor device with an array of semiconductor diode lasers and method of manufacturing such a device
US5638393A (en) * 1994-12-07 1997-06-10 Xerox Corporation Nonmonolithic multiple laser source arrays
JP2003243760A (en) * 2002-02-18 2003-08-29 Ricoh Co Ltd Light source module, light source device, optical scanner, and image forming device
JP2006054277A (en) * 2004-08-11 2006-02-23 Sony Corp Semiconductor laser light emitter and method for manufacturing semiconductor laser light emitter
JP2008169811A (en) * 2007-01-15 2008-07-24 Calsonic Compressor Inc Gas compressor
JP2008235750A (en) * 2007-03-23 2008-10-02 Seiko Epson Corp Laser element, method of manufacturing laser light source, laser light source, illuminating apparatus, monitoring apparatus, and projector

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