IT8323707A0 - WIRING SUBSTRATE, PROCEDURE FOR ITS MANUFACTURE, AND SEMICONDUCTOR DEVICE USING THE SUBSTRATE ITSELF. - Google Patents
WIRING SUBSTRATE, PROCEDURE FOR ITS MANUFACTURE, AND SEMICONDUCTOR DEVICE USING THE SUBSTRATE ITSELF.Info
- Publication number
- IT8323707A0 IT8323707A0 IT8323707A IT2370783A IT8323707A0 IT 8323707 A0 IT8323707 A0 IT 8323707A0 IT 8323707 A IT8323707 A IT 8323707A IT 2370783 A IT2370783 A IT 2370783A IT 8323707 A0 IT8323707 A0 IT 8323707A0
- Authority
- IT
- Italy
- Prior art keywords
- substrate
- procedure
- manufacture
- semiconductor device
- wiring substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01084—Polonium [Po]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01094—Plutonium [Pu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0495—5th Group
- H01L2924/04953—TaN
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0235—Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57197519A JPS5987893A (en) | 1982-11-12 | 1982-11-12 | Circuit board, method of producing same and semiconductor device using same |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8323707A0 true IT8323707A0 (en) | 1983-11-14 |
IT1166544B IT1166544B (en) | 1987-05-06 |
Family
ID=16375811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT2370783A IT1166544B (en) | 1982-11-12 | 1983-11-14 | WIRING SUBSTRATE, PROCEDURE FOR ITS MANUFACTURE, AND A SEMICONDUCTOR DEVICE USING THE SAME SUBSTRATE |
Country Status (9)
Country | Link |
---|---|
JP (1) | JPS5987893A (en) |
KR (1) | KR840006747A (en) |
DE (1) | DE3340926A1 (en) |
FR (1) | FR2536209A1 (en) |
GB (1) | GB2132411B (en) |
HK (1) | HK688A (en) |
IT (1) | IT1166544B (en) |
MY (1) | MY8700803A (en) |
SG (1) | SG88987G (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2561456A1 (en) * | 1984-03-16 | 1985-09-20 | Thomson Csf | Method of fabricating substrates with transverse electrical connection studs |
FR2567684B1 (en) * | 1984-07-10 | 1988-11-04 | Nec Corp | MODULE HAVING A MULTILAYER CERAMIC SUBSTRATE AND A MULTILAYER CIRCUIT ON THE SUBSTRATE AND METHOD FOR THE PRODUCTION THEREOF |
US4617730A (en) * | 1984-08-13 | 1986-10-21 | International Business Machines Corporation | Method of fabricating a chip interposer |
FR2575331B1 (en) * | 1984-12-21 | 1987-06-05 | Labo Electronique Physique | HOUSING FOR ELECTRONIC COMPONENT |
US4866507A (en) * | 1986-05-19 | 1989-09-12 | International Business Machines Corporation | Module for packaging semiconductor integrated circuit chips on a base substrate |
DE3630066C1 (en) * | 1986-09-04 | 1988-02-04 | Heraeus Gmbh W C | Process for the production of sintered metallized aluminum nitride ceramic bodies |
GB2209867B (en) * | 1987-09-16 | 1990-12-19 | Advanced Semiconductor Package | Method of forming an integrated circuit chip carrier |
US4880684A (en) * | 1988-03-11 | 1989-11-14 | International Business Machines Corporation | Sealing and stress relief layers and use thereof |
US5038252A (en) * | 1989-01-26 | 1991-08-06 | Teradyne, Inc. | Printed circuit boards with improved electrical current control |
JP3442895B2 (en) * | 1994-07-04 | 2003-09-02 | 新光電気工業株式会社 | Sintered body for substrate production, substrate and method for producing the same |
JPH10308565A (en) * | 1997-05-02 | 1998-11-17 | Shinko Electric Ind Co Ltd | Wiring board |
US6563210B2 (en) | 2000-12-19 | 2003-05-13 | Intel Corporation | Parallel plane substrate |
US7026223B2 (en) | 2002-03-28 | 2006-04-11 | M/A-Com, Inc | Hermetic electric component package |
FR2976720A1 (en) | 2011-06-15 | 2012-12-21 | St Microelectronics Sa | METHOD FOR ELECTRICAL CONNECTION BETWEEN ELEMENTS OF A THREE DIMENSIONAL INTEGRATED STRUCTURE, AND CORRESPONDING DEVICE |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1141029B (en) * | 1960-06-23 | 1962-12-13 | Siemens Ag | Semiconductor device and method for its manufacture |
GB1163785A (en) * | 1965-12-22 | 1969-09-10 | Texas Instruments Inc | Composite Header for a Semiconductor Device |
US3566208A (en) * | 1968-02-02 | 1971-02-23 | Fairchild Camera Instr Co | Pin socket |
DE1764262A1 (en) * | 1968-05-06 | 1971-07-01 | Siemens Ag | Semiconductor arrangement that is firmly attached to a base |
US3577037A (en) * | 1968-07-05 | 1971-05-04 | Ibm | Diffused electrical connector apparatus and method of making same |
JPS5128829B1 (en) * | 1968-10-21 | 1976-08-21 | ||
US3872583A (en) * | 1972-07-10 | 1975-03-25 | Amdahl Corp | LSI chip package and method |
US4109377A (en) * | 1976-02-03 | 1978-08-29 | International Business Machines Corporation | Method for preparing a multilayer ceramic |
CA1079309A (en) * | 1976-11-26 | 1980-06-10 | The Carborundum Company | Beryllium containing silicon carbide powder composition |
US4123286A (en) * | 1976-12-27 | 1978-10-31 | The Carborundum Company | Silicon carbide powder compositions |
JPS55143042A (en) * | 1979-04-25 | 1980-11-08 | Hitachi Ltd | Semiconductor device |
JPS5651846A (en) * | 1979-10-04 | 1981-05-09 | Fujitsu Ltd | Ic package |
EP0028802B1 (en) * | 1979-11-05 | 1983-08-17 | Hitachi, Ltd. | Electrically insulating substrate and a method of making such a substrate |
US4256792A (en) * | 1980-01-25 | 1981-03-17 | Honeywell Inc. | Composite electronic substrate of alumina uniformly needled through with aluminum nitride |
US4322778A (en) * | 1980-01-25 | 1982-03-30 | International Business Machines Corp. | High performance semiconductor package assembly |
-
1982
- 1982-11-12 JP JP57197519A patent/JPS5987893A/en active Pending
-
1983
- 1983-11-07 KR KR1019830005272A patent/KR840006747A/en not_active Application Discontinuation
- 1983-11-08 GB GB08329757A patent/GB2132411B/en not_active Expired
- 1983-11-09 FR FR8317781A patent/FR2536209A1/en not_active Withdrawn
- 1983-11-11 DE DE19833340926 patent/DE3340926A1/en not_active Withdrawn
- 1983-11-14 IT IT2370783A patent/IT1166544B/en active
-
1987
- 1987-10-12 SG SG88987A patent/SG88987G/en unknown
- 1987-12-30 MY MY8700803A patent/MY8700803A/en unknown
-
1988
- 1988-01-07 HK HK688A patent/HK688A/en unknown
Also Published As
Publication number | Publication date |
---|---|
SG88987G (en) | 1988-06-03 |
FR2536209A1 (en) | 1984-05-18 |
IT1166544B (en) | 1987-05-06 |
GB2132411A (en) | 1984-07-04 |
DE3340926A1 (en) | 1984-07-12 |
GB8329757D0 (en) | 1983-12-14 |
GB2132411B (en) | 1986-08-20 |
MY8700803A (en) | 1987-12-31 |
KR840006747A (en) | 1984-12-01 |
HK688A (en) | 1988-01-15 |
JPS5987893A (en) | 1984-05-21 |
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