GB8329757D0 - Substrate structures - Google Patents

Substrate structures

Info

Publication number
GB8329757D0
GB8329757D0 GB8329757A GB8329757A GB8329757D0 GB 8329757 D0 GB8329757 D0 GB 8329757D0 GB 8329757 A GB8329757 A GB 8329757A GB 8329757 A GB8329757 A GB 8329757A GB 8329757 D0 GB8329757 D0 GB 8329757D0
Authority
GB
United Kingdom
Prior art keywords
substrate
wires
hot
main
faces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8329757A
Other versions
GB2132411B (en
GB2132411A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB8329757D0 publication Critical patent/GB8329757D0/en
Publication of GB2132411A publication Critical patent/GB2132411A/en
Application granted granted Critical
Publication of GB2132411B publication Critical patent/GB2132411B/en
Expired legal-status Critical Current

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    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
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    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0495—5th Group
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    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0235—Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Die Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

A semiconductor device substrate which is sintered by a hot-pressing method at a very high temperature and under high pressure has two main faces parallel to each other, and a plurality of wires (2) formed therein to extend therethrough to end at these main faces. Semiconductor pellets (18) are bonded onto one main face, and a plurality of leads (27) are mounted onto the other main face. The substrate is made of silicon carbide containing a small quantity of beryllium, and the wires (2) of zirconium boride. A plate is prepared by preforming a powder of the substrate material and a plurality of wire stripes are printed thereon. A plurality of such plates laid over each other and hot-pressed provide a block which is sliced along planes normal to the wires, so that substrates are fabricated from the slices. Several layers (13, 14) of wiring may be formed on the substrate faces. <IMAGE>
GB08329757A 1982-11-12 1983-11-08 Improvements in substrate structures Expired GB2132411B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57197519A JPS5987893A (en) 1982-11-12 1982-11-12 Circuit board, method of producing same and semiconductor device using same

Publications (3)

Publication Number Publication Date
GB8329757D0 true GB8329757D0 (en) 1983-12-14
GB2132411A GB2132411A (en) 1984-07-04
GB2132411B GB2132411B (en) 1986-08-20

Family

ID=16375811

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08329757A Expired GB2132411B (en) 1982-11-12 1983-11-08 Improvements in substrate structures

Country Status (9)

Country Link
JP (1) JPS5987893A (en)
KR (1) KR840006747A (en)
DE (1) DE3340926A1 (en)
FR (1) FR2536209A1 (en)
GB (1) GB2132411B (en)
HK (1) HK688A (en)
IT (1) IT1166544B (en)
MY (1) MY8700803A (en)
SG (1) SG88987G (en)

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FR2561456A1 (en) * 1984-03-16 1985-09-20 Thomson Csf Method of fabricating substrates with transverse electrical connection studs
FR2567684B1 (en) * 1984-07-10 1988-11-04 Nec Corp MODULE HAVING A MULTILAYER CERAMIC SUBSTRATE AND A MULTILAYER CIRCUIT ON THE SUBSTRATE AND METHOD FOR THE PRODUCTION THEREOF
US4617730A (en) * 1984-08-13 1986-10-21 International Business Machines Corporation Method of fabricating a chip interposer
FR2575331B1 (en) * 1984-12-21 1987-06-05 Labo Electronique Physique HOUSING FOR ELECTRONIC COMPONENT
US4866507A (en) * 1986-05-19 1989-09-12 International Business Machines Corporation Module for packaging semiconductor integrated circuit chips on a base substrate
DE3630066C1 (en) * 1986-09-04 1988-02-04 Heraeus Gmbh W C Process for the production of sintered metallized aluminum nitride ceramic bodies
GB2209867B (en) * 1987-09-16 1990-12-19 Advanced Semiconductor Package Method of forming an integrated circuit chip carrier
US4880684A (en) * 1988-03-11 1989-11-14 International Business Machines Corporation Sealing and stress relief layers and use thereof
US5038252A (en) * 1989-01-26 1991-08-06 Teradyne, Inc. Printed circuit boards with improved electrical current control
JP3442895B2 (en) * 1994-07-04 2003-09-02 新光電気工業株式会社 Sintered body for substrate production, substrate and method for producing the same
JPH10308565A (en) * 1997-05-02 1998-11-17 Shinko Electric Ind Co Ltd Wiring board
US6563210B2 (en) 2000-12-19 2003-05-13 Intel Corporation Parallel plane substrate
US7026223B2 (en) 2002-03-28 2006-04-11 M/A-Com, Inc Hermetic electric component package
FR2976720A1 (en) * 2011-06-15 2012-12-21 St Microelectronics Sa METHOD FOR ELECTRICAL CONNECTION BETWEEN ELEMENTS OF A THREE DIMENSIONAL INTEGRATED STRUCTURE, AND CORRESPONDING DEVICE

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DE1141029B (en) * 1960-06-23 1962-12-13 Siemens Ag Semiconductor device and method for its manufacture
GB1163785A (en) * 1965-12-22 1969-09-10 Texas Instruments Inc Composite Header for a Semiconductor Device
US3566208A (en) * 1968-02-02 1971-02-23 Fairchild Camera Instr Co Pin socket
DE1764262A1 (en) * 1968-05-06 1971-07-01 Siemens Ag Semiconductor arrangement that is firmly attached to a base
US3577037A (en) * 1968-07-05 1971-05-04 Ibm Diffused electrical connector apparatus and method of making same
JPS5128829B1 (en) * 1968-10-21 1976-08-21
US3872583A (en) * 1972-07-10 1975-03-25 Amdahl Corp LSI chip package and method
US4109377A (en) * 1976-02-03 1978-08-29 International Business Machines Corporation Method for preparing a multilayer ceramic
CA1079309A (en) * 1976-11-26 1980-06-10 The Carborundum Company Beryllium containing silicon carbide powder composition
US4123286A (en) * 1976-12-27 1978-10-31 The Carborundum Company Silicon carbide powder compositions
JPS55143042A (en) * 1979-04-25 1980-11-08 Hitachi Ltd Semiconductor device
JPS5651846A (en) * 1979-10-04 1981-05-09 Fujitsu Ltd Ic package
DE3064598D1 (en) * 1979-11-05 1983-09-22 Hitachi Ltd Electrically insulating substrate and a method of making such a substrate
US4256792A (en) * 1980-01-25 1981-03-17 Honeywell Inc. Composite electronic substrate of alumina uniformly needled through with aluminum nitride
US4322778A (en) * 1980-01-25 1982-03-30 International Business Machines Corp. High performance semiconductor package assembly

Also Published As

Publication number Publication date
IT1166544B (en) 1987-05-06
HK688A (en) 1988-01-15
KR840006747A (en) 1984-12-01
SG88987G (en) 1988-06-03
IT8323707A0 (en) 1983-11-14
MY8700803A (en) 1987-12-31
JPS5987893A (en) 1984-05-21
GB2132411B (en) 1986-08-20
DE3340926A1 (en) 1984-07-12
GB2132411A (en) 1984-07-04
FR2536209A1 (en) 1984-05-18

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