JPS53108372A - Substrate for wireless bonding - Google Patents

Substrate for wireless bonding

Info

Publication number
JPS53108372A
JPS53108372A JP2275977A JP2275977A JPS53108372A JP S53108372 A JPS53108372 A JP S53108372A JP 2275977 A JP2275977 A JP 2275977A JP 2275977 A JP2275977 A JP 2275977A JP S53108372 A JPS53108372 A JP S53108372A
Authority
JP
Japan
Prior art keywords
substrate
wireless bonding
bonding
semiconductor element
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2275977A
Other languages
Japanese (ja)
Other versions
JPS5733856B2 (en
Inventor
Susumu Shibata
Keiji Murasugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP2275977A priority Critical patent/JPS53108372A/en
Publication of JPS53108372A publication Critical patent/JPS53108372A/en
Publication of JPS5733856B2 publication Critical patent/JPS5733856B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To simplify the checking of electrical connections for the semiconductor element and conductive pattern, by providing a plural number of lead wires with each terminal of the semiconductor element, in the wiring conductive pattern for bonding.
COPYRIGHT: (C)1978,JPO&Japio
JP2275977A 1977-03-04 1977-03-04 Substrate for wireless bonding Granted JPS53108372A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2275977A JPS53108372A (en) 1977-03-04 1977-03-04 Substrate for wireless bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2275977A JPS53108372A (en) 1977-03-04 1977-03-04 Substrate for wireless bonding

Publications (2)

Publication Number Publication Date
JPS53108372A true JPS53108372A (en) 1978-09-21
JPS5733856B2 JPS5733856B2 (en) 1982-07-20

Family

ID=12091600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2275977A Granted JPS53108372A (en) 1977-03-04 1977-03-04 Substrate for wireless bonding

Country Status (1)

Country Link
JP (1) JPS53108372A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4881029A (en) * 1985-09-30 1989-11-14 Kabushiki Kaisha Toshiba Semiconductor integrated circuit devices and methods for testing same
JP2005353757A (en) * 2004-06-09 2005-12-22 Toshiba Matsushita Display Technology Co Ltd Semiconductor device and connection resistance measuring method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4881029A (en) * 1985-09-30 1989-11-14 Kabushiki Kaisha Toshiba Semiconductor integrated circuit devices and methods for testing same
JP2005353757A (en) * 2004-06-09 2005-12-22 Toshiba Matsushita Display Technology Co Ltd Semiconductor device and connection resistance measuring method

Also Published As

Publication number Publication date
JPS5733856B2 (en) 1982-07-20

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