JPS5335472A - Production of semiconductor unit - Google Patents

Production of semiconductor unit

Info

Publication number
JPS5335472A
JPS5335472A JP11028476A JP11028476A JPS5335472A JP S5335472 A JPS5335472 A JP S5335472A JP 11028476 A JP11028476 A JP 11028476A JP 11028476 A JP11028476 A JP 11028476A JP S5335472 A JPS5335472 A JP S5335472A
Authority
JP
Japan
Prior art keywords
elements
production
semiconductor unit
axis
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11028476A
Other languages
Japanese (ja)
Inventor
Masaharu Noyori
Hiroaki Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11028476A priority Critical patent/JPS5335472A/en
Publication of JPS5335472A publication Critical patent/JPS5335472A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: A semiconductor wafer is scribed in one direction of X axis or Y axis, and obtained freezing elements rows are fixed on an insulating plate. Then, after the electrode of elements and the wiring on the substrate are connected electrically, they are divided into individual elements, so that assembly of elements where the electrode pad arrangement shapes like dual inline can be easy.
COPYRIGHT: (C)1978,JPO&Japio
JP11028476A 1976-09-14 1976-09-14 Production of semiconductor unit Pending JPS5335472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11028476A JPS5335472A (en) 1976-09-14 1976-09-14 Production of semiconductor unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11028476A JPS5335472A (en) 1976-09-14 1976-09-14 Production of semiconductor unit

Publications (1)

Publication Number Publication Date
JPS5335472A true JPS5335472A (en) 1978-04-01

Family

ID=14531781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11028476A Pending JPS5335472A (en) 1976-09-14 1976-09-14 Production of semiconductor unit

Country Status (1)

Country Link
JP (1) JPS5335472A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5872650U (en) * 1981-11-11 1983-05-17 株式会社東洋精機製作所 Initial adhesion measurement test device
JPS62267646A (en) * 1986-05-16 1987-11-20 Asahi Seiko Kk Method and device for measuring rolling type adhesive strength

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5872650U (en) * 1981-11-11 1983-05-17 株式会社東洋精機製作所 Initial adhesion measurement test device
JPS62267646A (en) * 1986-05-16 1987-11-20 Asahi Seiko Kk Method and device for measuring rolling type adhesive strength

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