JPS52154358A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS52154358A JPS52154358A JP7109276A JP7109276A JPS52154358A JP S52154358 A JPS52154358 A JP S52154358A JP 7109276 A JP7109276 A JP 7109276A JP 7109276 A JP7109276 A JP 7109276A JP S52154358 A JPS52154358 A JP S52154358A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- tab
- insulator
- flush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To improvement in the efficiency of connecting works and the reduction in costs are achieved by fixing the surface of a pellet fixed to the tab of a lead frame with an insulator so as to make it flush to leads and forming a conductive layer through printing-on thereby performing connection.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7109276A JPS52154358A (en) | 1976-06-18 | 1976-06-18 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7109276A JPS52154358A (en) | 1976-06-18 | 1976-06-18 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52154358A true JPS52154358A (en) | 1977-12-22 |
Family
ID=13450539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7109276A Pending JPS52154358A (en) | 1976-06-18 | 1976-06-18 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52154358A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60121752A (en) * | 1984-07-25 | 1985-06-29 | Hitachi Ltd | Semiconductor device |
JPS62232948A (en) * | 1986-04-03 | 1987-10-13 | Sumitomo Metal Mining Co Ltd | Lead frame |
JPS6411357A (en) * | 1987-07-04 | 1989-01-13 | Horiba Ltd | Method of taking out lead of semiconductor chip component |
JPH01137661A (en) * | 1987-11-24 | 1989-05-30 | Nec Corp | Lead frame |
JPH02278757A (en) * | 1989-04-19 | 1990-11-15 | Nec Corp | Hybrid integrated circuit |
-
1976
- 1976-06-18 JP JP7109276A patent/JPS52154358A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60121752A (en) * | 1984-07-25 | 1985-06-29 | Hitachi Ltd | Semiconductor device |
JPS62232948A (en) * | 1986-04-03 | 1987-10-13 | Sumitomo Metal Mining Co Ltd | Lead frame |
JPH0582977B2 (en) * | 1986-04-03 | 1993-11-24 | Sumitomo Metal Mining Co | |
JPS6411357A (en) * | 1987-07-04 | 1989-01-13 | Horiba Ltd | Method of taking out lead of semiconductor chip component |
JPH01137661A (en) * | 1987-11-24 | 1989-05-30 | Nec Corp | Lead frame |
JPH02278757A (en) * | 1989-04-19 | 1990-11-15 | Nec Corp | Hybrid integrated circuit |
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