JPS528785A - Semiconductor device electrode structure - Google Patents
Semiconductor device electrode structureInfo
- Publication number
- JPS528785A JPS528785A JP50084674A JP8467475A JPS528785A JP S528785 A JPS528785 A JP S528785A JP 50084674 A JP50084674 A JP 50084674A JP 8467475 A JP8467475 A JP 8467475A JP S528785 A JPS528785 A JP S528785A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- electrode structure
- device electrode
- changing
- providing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/023—Redistribution layers [RDL] for bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE: To increase electrode area without changing the chip size by providing a second metal wiring layer.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50084674A JPS528785A (en) | 1975-07-10 | 1975-07-10 | Semiconductor device electrode structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50084674A JPS528785A (en) | 1975-07-10 | 1975-07-10 | Semiconductor device electrode structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS528785A true JPS528785A (en) | 1977-01-22 |
Family
ID=13837240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50084674A Pending JPS528785A (en) | 1975-07-10 | 1975-07-10 | Semiconductor device electrode structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS528785A (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5671510A (en) * | 1979-11-14 | 1981-06-15 | Hitachi Ltd | Roll neck bearing device for rolling mill |
JPS5739556A (en) * | 1980-08-22 | 1982-03-04 | Citizen Watch Co Ltd | Ic electrode structure |
JPS57106140A (en) * | 1980-12-24 | 1982-07-01 | Hitachi Ltd | Semiconductor device and manufacture thereof |
JPS57121812A (en) * | 1981-01-21 | 1982-07-29 | Hitachi Ltd | Bearing for roll of rolling mill |
JPS58194805U (en) * | 1982-06-18 | 1983-12-24 | 株式会社神戸製鋼所 | Bearing device for rolling rolls |
JPS59113646A (en) * | 1982-12-20 | 1984-06-30 | Matsushita Electric Ind Co Ltd | Semiconductor device |
JPS60132221U (en) * | 1984-02-15 | 1985-09-04 | 株式会社日立ホームテック | Removable plate hot plate |
JPS6384050A (en) * | 1986-09-26 | 1988-04-14 | Nec Corp | Integrated circuit |
US5394013A (en) * | 1990-11-28 | 1995-02-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device with an elevated bonding pad |
JPH1065044A (en) * | 1996-06-07 | 1998-03-06 | Lsi Logic Corp | Semiconductor die having staggered bond pads |
EP1006576A1 (en) * | 1998-11-30 | 2000-06-07 | Sharp Kabushiki Kaisha | Semiconductor device |
JP2005217445A (en) * | 1996-12-04 | 2005-08-11 | Seiko Epson Corp | Production process of semiconductor device |
JP2006318987A (en) * | 2005-05-10 | 2006-11-24 | Rohm Co Ltd | Semiconductor chip, electrode structure thereof, and its formation method |
US7183189B2 (en) | 1996-12-04 | 2007-02-27 | Seiko Epson Corporation | Semiconductor device, circuit board, and electronic instrument |
US7470979B2 (en) | 1996-12-04 | 2008-12-30 | Seiko Epson Corporation | Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49116961A (en) * | 1973-03-09 | 1974-11-08 |
-
1975
- 1975-07-10 JP JP50084674A patent/JPS528785A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49116961A (en) * | 1973-03-09 | 1974-11-08 |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5671510A (en) * | 1979-11-14 | 1981-06-15 | Hitachi Ltd | Roll neck bearing device for rolling mill |
JPS614284B2 (en) * | 1979-11-14 | 1986-02-08 | Hitachi Ltd | |
JPS5739556A (en) * | 1980-08-22 | 1982-03-04 | Citizen Watch Co Ltd | Ic electrode structure |
JPS57106140A (en) * | 1980-12-24 | 1982-07-01 | Hitachi Ltd | Semiconductor device and manufacture thereof |
JPS6322464B2 (en) * | 1980-12-24 | 1988-05-12 | Hitachi Ltd | |
JPS57121812A (en) * | 1981-01-21 | 1982-07-29 | Hitachi Ltd | Bearing for roll of rolling mill |
JPS58194805U (en) * | 1982-06-18 | 1983-12-24 | 株式会社神戸製鋼所 | Bearing device for rolling rolls |
JPH0133202Y2 (en) * | 1982-06-18 | 1989-10-09 | ||
JPS59113646A (en) * | 1982-12-20 | 1984-06-30 | Matsushita Electric Ind Co Ltd | Semiconductor device |
JPS60132221U (en) * | 1984-02-15 | 1985-09-04 | 株式会社日立ホームテック | Removable plate hot plate |
JPH0111153Y2 (en) * | 1984-02-15 | 1989-03-31 | ||
JPS6384050A (en) * | 1986-09-26 | 1988-04-14 | Nec Corp | Integrated circuit |
US5394013A (en) * | 1990-11-28 | 1995-02-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device with an elevated bonding pad |
JPH1065044A (en) * | 1996-06-07 | 1998-03-06 | Lsi Logic Corp | Semiconductor die having staggered bond pads |
JP4656676B2 (en) * | 1996-06-07 | 2011-03-23 | エルエスアイ コーポレーション | Semiconductor device having staggered bond pads |
US7842598B2 (en) | 1996-12-04 | 2010-11-30 | Seiko Epson Corporation | Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
US7183189B2 (en) | 1996-12-04 | 2007-02-27 | Seiko Epson Corporation | Semiconductor device, circuit board, and electronic instrument |
US7470979B2 (en) | 1996-12-04 | 2008-12-30 | Seiko Epson Corporation | Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
US7511362B2 (en) | 1996-12-04 | 2009-03-31 | Seiko Epson Corporation | Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
US7521796B2 (en) | 1996-12-04 | 2009-04-21 | Seiko Epson Corporation | Method of making the semiconductor device, circuit board, and electronic instrument |
JP4513973B2 (en) * | 1996-12-04 | 2010-07-28 | セイコーエプソン株式会社 | Manufacturing method of semiconductor device |
JP2005217445A (en) * | 1996-12-04 | 2005-08-11 | Seiko Epson Corp | Production process of semiconductor device |
US7888260B2 (en) | 1996-12-04 | 2011-02-15 | Seiko Epson Corporation | Method of making electronic device |
US8115284B2 (en) | 1996-12-04 | 2012-02-14 | Seiko Epson Corporation | Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument |
US8384213B2 (en) | 1996-12-04 | 2013-02-26 | Seiko Epson Corporation | Semiconductor device, circuit board, and electronic instrument |
EP1006576A1 (en) * | 1998-11-30 | 2000-06-07 | Sharp Kabushiki Kaisha | Semiconductor device |
JP2006318987A (en) * | 2005-05-10 | 2006-11-24 | Rohm Co Ltd | Semiconductor chip, electrode structure thereof, and its formation method |
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