JPS5512749A - Compound integrated circuit - Google Patents

Compound integrated circuit

Info

Publication number
JPS5512749A
JPS5512749A JP8560078A JP8560078A JPS5512749A JP S5512749 A JPS5512749 A JP S5512749A JP 8560078 A JP8560078 A JP 8560078A JP 8560078 A JP8560078 A JP 8560078A JP S5512749 A JPS5512749 A JP S5512749A
Authority
JP
Japan
Prior art keywords
section
paste
brazing
conductor layers
paradium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8560078A
Other languages
Japanese (ja)
Inventor
Tetsuo Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8560078A priority Critical patent/JPS5512749A/en
Publication of JPS5512749A publication Critical patent/JPS5512749A/en
Pending legal-status Critical Current

Links

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  • Wire Bonding (AREA)

Abstract

PURPOSE: To minimize loss of wiring conductor layer by using a paste consisting mainly of silver-paradium system metallic material for an element brazing section and a paste of gold system metallic material for other section of the element than the brazing section.
CONSTITUTION: On an insulation base plate 1 consisting of alumina porcelain, an element brazing section having a circuit element on it is provided with No. 1 conductor layers 2-1W2-4 to be formed by screen-printing and firing of silver-paradium paste and other section than the lement brazing section is provided with No. 2 conductor layers 3-1W3-6 to be formed by screen-printing and firing of gold paste, and these are composed as conductors with the prescribed pattern, and ends of these conductor layers 2-1W2-4 and 3-1W3-6 are formed in layers which are electrically connected with one another.
COPYRIGHT: (C)1980,JPO&Japio
JP8560078A 1978-07-12 1978-07-12 Compound integrated circuit Pending JPS5512749A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8560078A JPS5512749A (en) 1978-07-12 1978-07-12 Compound integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8560078A JPS5512749A (en) 1978-07-12 1978-07-12 Compound integrated circuit

Publications (1)

Publication Number Publication Date
JPS5512749A true JPS5512749A (en) 1980-01-29

Family

ID=13863309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8560078A Pending JPS5512749A (en) 1978-07-12 1978-07-12 Compound integrated circuit

Country Status (1)

Country Link
JP (1) JPS5512749A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0237735A (en) * 1988-07-27 1990-02-07 Semiconductor Energy Lab Co Ltd Mounting structure of semiconductor chip
JPH0590953U (en) * 1992-05-07 1993-12-10 株式会社大真空 Surface mount electronic components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0237735A (en) * 1988-07-27 1990-02-07 Semiconductor Energy Lab Co Ltd Mounting structure of semiconductor chip
JPH0590953U (en) * 1992-05-07 1993-12-10 株式会社大真空 Surface mount electronic components

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