JPS5512749A - Compound integrated circuit - Google Patents
Compound integrated circuitInfo
- Publication number
- JPS5512749A JPS5512749A JP8560078A JP8560078A JPS5512749A JP S5512749 A JPS5512749 A JP S5512749A JP 8560078 A JP8560078 A JP 8560078A JP 8560078 A JP8560078 A JP 8560078A JP S5512749 A JPS5512749 A JP S5512749A
- Authority
- JP
- Japan
- Prior art keywords
- section
- paste
- brazing
- conductor layers
- paradium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: To minimize loss of wiring conductor layer by using a paste consisting mainly of silver-paradium system metallic material for an element brazing section and a paste of gold system metallic material for other section of the element than the brazing section.
CONSTITUTION: On an insulation base plate 1 consisting of alumina porcelain, an element brazing section having a circuit element on it is provided with No. 1 conductor layers 2-1W2-4 to be formed by screen-printing and firing of silver-paradium paste and other section than the lement brazing section is provided with No. 2 conductor layers 3-1W3-6 to be formed by screen-printing and firing of gold paste, and these are composed as conductors with the prescribed pattern, and ends of these conductor layers 2-1W2-4 and 3-1W3-6 are formed in layers which are electrically connected with one another.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8560078A JPS5512749A (en) | 1978-07-12 | 1978-07-12 | Compound integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8560078A JPS5512749A (en) | 1978-07-12 | 1978-07-12 | Compound integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5512749A true JPS5512749A (en) | 1980-01-29 |
Family
ID=13863309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8560078A Pending JPS5512749A (en) | 1978-07-12 | 1978-07-12 | Compound integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5512749A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0237735A (en) * | 1988-07-27 | 1990-02-07 | Semiconductor Energy Lab Co Ltd | Mounting structure of semiconductor chip |
JPH0590953U (en) * | 1992-05-07 | 1993-12-10 | 株式会社大真空 | Surface mount electronic components |
-
1978
- 1978-07-12 JP JP8560078A patent/JPS5512749A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0237735A (en) * | 1988-07-27 | 1990-02-07 | Semiconductor Energy Lab Co Ltd | Mounting structure of semiconductor chip |
JPH0590953U (en) * | 1992-05-07 | 1993-12-10 | 株式会社大真空 | Surface mount electronic components |
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