JPS5265666A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5265666A
JPS5265666A JP50141671A JP14167175A JPS5265666A JP S5265666 A JPS5265666 A JP S5265666A JP 50141671 A JP50141671 A JP 50141671A JP 14167175 A JP14167175 A JP 14167175A JP S5265666 A JPS5265666 A JP S5265666A
Authority
JP
Japan
Prior art keywords
semiconductor device
substrate
surfacae
electorde
integration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50141671A
Other languages
Japanese (ja)
Inventor
Kaoru Niino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50141671A priority Critical patent/JPS5265666A/en
Publication of JPS5265666A publication Critical patent/JPS5265666A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Abstract

PURPOSE: To produce a semiconductor device of high reliability and a high scale of integration by providing a pad electrode on the rear surfacae of a substrate and connecting said electorde to surface wiring layer by using an isolated conductor layer within the substrate.
COPYRIGHT: (C)1977,JPO&Japio
JP50141671A 1975-11-28 1975-11-28 Semiconductor device Pending JPS5265666A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50141671A JPS5265666A (en) 1975-11-28 1975-11-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50141671A JPS5265666A (en) 1975-11-28 1975-11-28 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5265666A true JPS5265666A (en) 1977-05-31

Family

ID=15297473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50141671A Pending JPS5265666A (en) 1975-11-28 1975-11-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5265666A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5065216A (en) * 1989-02-09 1991-11-12 Fujitsu Ltd. Semiconductor integrated circuit having interconnection with improved design flexibility, and method of production
US5122856A (en) * 1987-11-13 1992-06-16 Nissan Motor Co., Ltd. Semiconductor device
US5240867A (en) * 1989-02-09 1993-08-31 Fujitsu Limited Semiconductor integrated circuit having interconnection with improved design flexibility, and method of production
US6720661B2 (en) * 2000-06-02 2004-04-13 Seiko Epson Corporation Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5122856A (en) * 1987-11-13 1992-06-16 Nissan Motor Co., Ltd. Semiconductor device
US5065216A (en) * 1989-02-09 1991-11-12 Fujitsu Ltd. Semiconductor integrated circuit having interconnection with improved design flexibility, and method of production
US5240867A (en) * 1989-02-09 1993-08-31 Fujitsu Limited Semiconductor integrated circuit having interconnection with improved design flexibility, and method of production
US6720661B2 (en) * 2000-06-02 2004-04-13 Seiko Epson Corporation Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument
US6962865B2 (en) 2000-06-02 2005-11-08 Seiko Epson Corporation Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument
US7102219B2 (en) 2000-06-02 2006-09-05 Seiko Epson Corporation Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument

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