JPS6435925A - Integrated circuit element - Google Patents

Integrated circuit element

Info

Publication number
JPS6435925A
JPS6435925A JP19169587A JP19169587A JPS6435925A JP S6435925 A JPS6435925 A JP S6435925A JP 19169587 A JP19169587 A JP 19169587A JP 19169587 A JP19169587 A JP 19169587A JP S6435925 A JPS6435925 A JP S6435925A
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit element
base films
tape carrier
wirings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19169587A
Other languages
Japanese (ja)
Inventor
Kenichi Niki
Tooru Kokogawa
Hayato Takasago
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP19169587A priority Critical patent/JPS6435925A/en
Publication of JPS6435925A publication Critical patent/JPS6435925A/en
Priority to US07/442,416 priority patent/US4967261A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To enable the input.output wirings on an integrated circuit element to be made by a method wherein base films of a tape carrier are arranged on the integrated circuit element to arrange conductor wirings on the base films. CONSTITUTION:Base films 3a, 3f of a tape carrier 3 are arranged on an integrated circuit element 1 to arrange conductor wirings on these base films 3a, 3f. Furthermore, one ends of a part or all conductors of the tape carrier 3 connected to the protruding electrode 2 of the integrated circuit element 1 are connected to the base films 3a, 3f arranged on the element 1. In such a constitution, the base films 3a, 3f discharge the function of insulating layers of the conductor wirings of the tape carrier 3 from the inner wirings of the integrated circuit element 1 enabling the conductor wirings of the tape carrier 3 on the integrated circuit element 1 to be made.
JP19169587A 1987-07-30 1987-07-30 Integrated circuit element Pending JPS6435925A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP19169587A JPS6435925A (en) 1987-07-30 1987-07-30 Integrated circuit element
US07/442,416 US4967261A (en) 1987-07-30 1989-11-22 Tape carrier for assembling an IC chip on a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19169587A JPS6435925A (en) 1987-07-30 1987-07-30 Integrated circuit element

Publications (1)

Publication Number Publication Date
JPS6435925A true JPS6435925A (en) 1989-02-07

Family

ID=16278930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19169587A Pending JPS6435925A (en) 1987-07-30 1987-07-30 Integrated circuit element

Country Status (1)

Country Link
JP (1) JPS6435925A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02161738A (en) * 1988-12-15 1990-06-21 Hitachi Cable Ltd Tape carrier for tab

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817630A (en) * 1981-07-13 1983-02-01 フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン Tape automatic bonding for collected circuit
JPS5939930B2 (en) * 1979-07-13 1984-09-27 日本電信電話株式会社 Standard frequency supply method
JPS601838A (en) * 1983-06-17 1985-01-08 Matsushita Electric Ind Co Ltd Semiconductor device
JPS62169432A (en) * 1986-01-22 1987-07-25 Oki Electric Ind Co Ltd Method for connection of semiconductor element

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5939930B2 (en) * 1979-07-13 1984-09-27 日本電信電話株式会社 Standard frequency supply method
JPS5817630A (en) * 1981-07-13 1983-02-01 フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン Tape automatic bonding for collected circuit
JPS601838A (en) * 1983-06-17 1985-01-08 Matsushita Electric Ind Co Ltd Semiconductor device
JPS62169432A (en) * 1986-01-22 1987-07-25 Oki Electric Ind Co Ltd Method for connection of semiconductor element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02161738A (en) * 1988-12-15 1990-06-21 Hitachi Cable Ltd Tape carrier for tab

Similar Documents

Publication Publication Date Title
JPS6437032A (en) Bendable lead frame assembly of integrated circuit and integrated circuit package
DE3889762T2 (en) Electrical circuit with superconducting multilayer structure and manufacturing process therefor.
JPS5335451A (en) Small size desk type calculator
DE68918487D1 (en) Electrical device with improved conductors for surface mounting of printed circuits.
DE3587202T2 (en) ELECTRICAL INSULATION CIRCUIT.
ES556828A0 (en) AN ELECTRICAL CIRCUIT BREAKER.
ATE39395T1 (en) BRIDGE ELEMENT.
DE3580877D1 (en) ELECTRICAL CIRCUITS AND COMPONENTS.
DE3682868D1 (en) ELECTRICAL CIRCUIT ARRANGEMENT.
JPS5351985A (en) Semiconductor wiring constitution
JPS6435925A (en) Integrated circuit element
JPS5724563A (en) Semiconductor device
AU508476B2 (en) Semiconductor circuit
NL7707454A (en) ELECTRICAL CIRCUIT.
JPS53108372A (en) Substrate for wireless bonding
JPS6428891A (en) Multi-layer printed circuit board
JPS5613759A (en) Hybrid integrated circuit
GB1553133A (en) Electrical dual-inline circuit package
GB1303650A (en)
JPS5441443A (en) Integrated circuit device
JPS5376728A (en) Microwave circuit
JPS5212572A (en) Semi-conductor device
JPS5571053A (en) Circuit device
JPS57159054A (en) Multitip package
JPS5353767A (en) Circuit substrate connecting terminal structure