JPS6435925A - Integrated circuit element - Google Patents
Integrated circuit elementInfo
- Publication number
- JPS6435925A JPS6435925A JP19169587A JP19169587A JPS6435925A JP S6435925 A JPS6435925 A JP S6435925A JP 19169587 A JP19169587 A JP 19169587A JP 19169587 A JP19169587 A JP 19169587A JP S6435925 A JPS6435925 A JP S6435925A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit element
- base films
- tape carrier
- wirings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To enable the input.output wirings on an integrated circuit element to be made by a method wherein base films of a tape carrier are arranged on the integrated circuit element to arrange conductor wirings on the base films. CONSTITUTION:Base films 3a, 3f of a tape carrier 3 are arranged on an integrated circuit element 1 to arrange conductor wirings on these base films 3a, 3f. Furthermore, one ends of a part or all conductors of the tape carrier 3 connected to the protruding electrode 2 of the integrated circuit element 1 are connected to the base films 3a, 3f arranged on the element 1. In such a constitution, the base films 3a, 3f discharge the function of insulating layers of the conductor wirings of the tape carrier 3 from the inner wirings of the integrated circuit element 1 enabling the conductor wirings of the tape carrier 3 on the integrated circuit element 1 to be made.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19169587A JPS6435925A (en) | 1987-07-30 | 1987-07-30 | Integrated circuit element |
US07/442,416 US4967261A (en) | 1987-07-30 | 1989-11-22 | Tape carrier for assembling an IC chip on a substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19169587A JPS6435925A (en) | 1987-07-30 | 1987-07-30 | Integrated circuit element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6435925A true JPS6435925A (en) | 1989-02-07 |
Family
ID=16278930
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19169587A Pending JPS6435925A (en) | 1987-07-30 | 1987-07-30 | Integrated circuit element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6435925A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02161738A (en) * | 1988-12-15 | 1990-06-21 | Hitachi Cable Ltd | Tape carrier for tab |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5817630A (en) * | 1981-07-13 | 1983-02-01 | フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン | Tape automatic bonding for collected circuit |
JPS5939930B2 (en) * | 1979-07-13 | 1984-09-27 | 日本電信電話株式会社 | Standard frequency supply method |
JPS601838A (en) * | 1983-06-17 | 1985-01-08 | Matsushita Electric Ind Co Ltd | Semiconductor device |
JPS62169432A (en) * | 1986-01-22 | 1987-07-25 | Oki Electric Ind Co Ltd | Method for connection of semiconductor element |
-
1987
- 1987-07-30 JP JP19169587A patent/JPS6435925A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5939930B2 (en) * | 1979-07-13 | 1984-09-27 | 日本電信電話株式会社 | Standard frequency supply method |
JPS5817630A (en) * | 1981-07-13 | 1983-02-01 | フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン | Tape automatic bonding for collected circuit |
JPS601838A (en) * | 1983-06-17 | 1985-01-08 | Matsushita Electric Ind Co Ltd | Semiconductor device |
JPS62169432A (en) * | 1986-01-22 | 1987-07-25 | Oki Electric Ind Co Ltd | Method for connection of semiconductor element |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02161738A (en) * | 1988-12-15 | 1990-06-21 | Hitachi Cable Ltd | Tape carrier for tab |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6437032A (en) | Bendable lead frame assembly of integrated circuit and integrated circuit package | |
DE3889762T2 (en) | Electrical circuit with superconducting multilayer structure and manufacturing process therefor. | |
JPS5335451A (en) | Small size desk type calculator | |
DE68918487D1 (en) | Electrical device with improved conductors for surface mounting of printed circuits. | |
DE3587202T2 (en) | ELECTRICAL INSULATION CIRCUIT. | |
ES556828A0 (en) | AN ELECTRICAL CIRCUIT BREAKER. | |
ATE39395T1 (en) | BRIDGE ELEMENT. | |
DE3580877D1 (en) | ELECTRICAL CIRCUITS AND COMPONENTS. | |
DE3682868D1 (en) | ELECTRICAL CIRCUIT ARRANGEMENT. | |
JPS5351985A (en) | Semiconductor wiring constitution | |
JPS6435925A (en) | Integrated circuit element | |
JPS5724563A (en) | Semiconductor device | |
AU508476B2 (en) | Semiconductor circuit | |
NL7707454A (en) | ELECTRICAL CIRCUIT. | |
JPS53108372A (en) | Substrate for wireless bonding | |
JPS6428891A (en) | Multi-layer printed circuit board | |
JPS5613759A (en) | Hybrid integrated circuit | |
GB1553133A (en) | Electrical dual-inline circuit package | |
GB1303650A (en) | ||
JPS5441443A (en) | Integrated circuit device | |
JPS5376728A (en) | Microwave circuit | |
JPS5212572A (en) | Semi-conductor device | |
JPS5571053A (en) | Circuit device | |
JPS57159054A (en) | Multitip package | |
JPS5353767A (en) | Circuit substrate connecting terminal structure |