JPS5513933A - Circuit element substrate and its manufacturing method - Google Patents

Circuit element substrate and its manufacturing method

Info

Publication number
JPS5513933A
JPS5513933A JP8674578A JP8674578A JPS5513933A JP S5513933 A JPS5513933 A JP S5513933A JP 8674578 A JP8674578 A JP 8674578A JP 8674578 A JP8674578 A JP 8674578A JP S5513933 A JPS5513933 A JP S5513933A
Authority
JP
Japan
Prior art keywords
glass
expansibility
electrode pattern
ceramic substrate
circuit element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8674578A
Other languages
Japanese (ja)
Other versions
JPS5835367B2 (en
Inventor
Sadakimi Ooyama
Zenjiro Unno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsumi Electric Co Ltd
Original Assignee
Mitsumi Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsumi Electric Co Ltd filed Critical Mitsumi Electric Co Ltd
Priority to JP53086745A priority Critical patent/JPS5835367B2/en
Priority to GB7914818A priority patent/GB2026234B/en
Priority to DE19792925509 priority patent/DE2925509A1/en
Publication of JPS5513933A publication Critical patent/JPS5513933A/en
Publication of JPS5835367B2 publication Critical patent/JPS5835367B2/en
Expired legal-status Critical Current

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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE: To prevent the disconnection of a lead line or the increase of a leak current by sealing a circuit element on the ceramic substrate with the glass composed of a predetermined material.
CONSTITUTION: A basic layer group of an electrode pattern is formed on a ceramic substrate 1, a concave portion 3 and a slot 4 are press-shaped corresponding to the basic layer, and a Ni plating is provided to make an electrode pattern group 5. A semiconductor chip 6 is attached to the concave portion 3 and the wiring 8 is provided therefor. Successively, a glass grain 10 is mounted on the chip by utilizing a tool. The glass has the expansibility of 72×10-7/°C which is substantially equal to the expansibility of the ceramic substrate of 70×10-7/°C and the melting point of 360 to 430°C to prevent oxidization of the electrode pattern or remelt due to sloder impregnation. BSG is used for the glass material. A glass sealing 10' is established by melting the glass grain 10. Successively, a simple substance 11 can be obtained along the slot 4. The substrate 1 and glass 10' are alike in their expansibility, any disconnection may not be occurred and the glass 10' hardly absorbes the water accordingly, the leak current of the lead 8 is not generated.
COPYRIGHT: (C)1980,JPO&Japio
JP53086745A 1978-07-18 1978-07-18 Circuit element board and its manufacturing method Expired JPS5835367B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP53086745A JPS5835367B2 (en) 1978-07-18 1978-07-18 Circuit element board and its manufacturing method
GB7914818A GB2026234B (en) 1978-07-18 1979-04-27 Circuit element package having lead patterns
DE19792925509 DE2925509A1 (en) 1978-07-18 1979-06-25 PACKAGE FOR CIRCUIT ELEMENTS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53086745A JPS5835367B2 (en) 1978-07-18 1978-07-18 Circuit element board and its manufacturing method

Publications (2)

Publication Number Publication Date
JPS5513933A true JPS5513933A (en) 1980-01-31
JPS5835367B2 JPS5835367B2 (en) 1983-08-02

Family

ID=13895318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53086745A Expired JPS5835367B2 (en) 1978-07-18 1978-07-18 Circuit element board and its manufacturing method

Country Status (3)

Country Link
JP (1) JPS5835367B2 (en)
DE (1) DE2925509A1 (en)
GB (1) GB2026234B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60201026A (en) * 1984-03-24 1985-10-11 Mazda Motor Corp Supercharger of rotary piston engine
JPH07157004A (en) * 1993-12-02 1995-06-20 Fuji Car Mfg Co Ltd Sorted collecting device for refuse and method

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2492164B1 (en) * 1980-10-15 1987-01-23 Radiotechnique Compelec METHOD FOR THE SIMULTANEOUS REALIZATION OF MULTIPLE ELECTRICAL LINKS, PARTICULARLY FOR THE ELECTRICAL CONNECTION OF A SEMICONDUCTOR MICRO-WAFER
JPS57207356A (en) * 1981-06-15 1982-12-20 Fujitsu Ltd Semiconductor device
FR2512990B1 (en) * 1981-09-11 1987-06-19 Radiotechnique Compelec METHOD FOR MANUFACTURING AN ELECTRONIC PAYMENT CARD, AND CARD REALIZED ACCORDING TO THIS METHOD
ATE15270T1 (en) * 1981-11-27 1985-09-15 Rheometron Ag MEASURING TRANSDUCER FOR MAGNETIC-INDUCTION FLOWMETERING DEVICES.
EP0110285A3 (en) * 1982-11-27 1985-11-21 Prutec Limited Interconnection of integrated circuits
JPS60211960A (en) * 1984-04-06 1985-10-24 Hitachi Ltd Semiconductor device
US4839713A (en) * 1987-02-20 1989-06-13 Mitsubishi Denki Kabushiki Kaisha Package structure for semiconductor device
GB2223354B (en) * 1988-09-30 1992-10-14 Marconi Electronic Devices Semiconductor devices
FR2667443A1 (en) * 1990-09-28 1992-04-03 Thomson Csf METHOD FOR PRODUCING A HYBRID MODULE
EP0598914B1 (en) * 1992-06-05 2000-10-11 Mitsui Chemicals, Inc. Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board
US5408126A (en) * 1993-12-17 1995-04-18 At&T Corp. Manufacture of semiconductor devices and novel lead frame assembly
US5629835A (en) * 1994-07-19 1997-05-13 Olin Corporation Metal ball grid array package with improved thermal conductivity

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60201026A (en) * 1984-03-24 1985-10-11 Mazda Motor Corp Supercharger of rotary piston engine
JPH041174B2 (en) * 1984-03-24 1992-01-10 Mazda Motor
JPH07157004A (en) * 1993-12-02 1995-06-20 Fuji Car Mfg Co Ltd Sorted collecting device for refuse and method

Also Published As

Publication number Publication date
GB2026234A (en) 1980-01-30
GB2026234B (en) 1982-06-30
DE2925509A1 (en) 1980-01-31
JPS5835367B2 (en) 1983-08-02

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