JPS5365660A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5365660A
JPS5365660A JP14161276A JP14161276A JPS5365660A JP S5365660 A JPS5365660 A JP S5365660A JP 14161276 A JP14161276 A JP 14161276A JP 14161276 A JP14161276 A JP 14161276A JP S5365660 A JPS5365660 A JP S5365660A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
plating
electrode
island electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14161276A
Other languages
Japanese (ja)
Other versions
JPS5724925B2 (en
Inventor
Hayashi Kuroki
Kuniyoshi Fukuda
Masayuki Hokao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP14161276A priority Critical patent/JPS5365660A/en
Publication of JPS5365660A publication Critical patent/JPS5365660A/en
Publication of JPS5724925B2 publication Critical patent/JPS5724925B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Abstract

PURPOSE: To shorten the plating time as well as to avoid the waste of the plating material, by covering the island electrode connected to semiconductor element having a faulty PN junction in a semiconductor substrate with an insulator and then forming a swelled electrode on the island electrode through plating for other normal semiconductor elements.
COPYRIGHT: (C)1978,JPO&Japio
JP14161276A 1976-11-24 1976-11-24 Manufacture of semiconductor device Granted JPS5365660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14161276A JPS5365660A (en) 1976-11-24 1976-11-24 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14161276A JPS5365660A (en) 1976-11-24 1976-11-24 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5365660A true JPS5365660A (en) 1978-06-12
JPS5724925B2 JPS5724925B2 (en) 1982-05-26

Family

ID=15296065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14161276A Granted JPS5365660A (en) 1976-11-24 1976-11-24 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5365660A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6066834A (en) * 1983-09-24 1985-04-17 Nec Kansai Ltd Manufacture of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6066834A (en) * 1983-09-24 1985-04-17 Nec Kansai Ltd Manufacture of semiconductor device
JPH0342494B2 (en) * 1983-09-24 1991-06-27

Also Published As

Publication number Publication date
JPS5724925B2 (en) 1982-05-26

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