JPS5310266A - Production of soldred semiconductor wafers - Google Patents

Production of soldred semiconductor wafers

Info

Publication number
JPS5310266A
JPS5310266A JP8544576A JP8544576A JPS5310266A JP S5310266 A JPS5310266 A JP S5310266A JP 8544576 A JP8544576 A JP 8544576A JP 8544576 A JP8544576 A JP 8544576A JP S5310266 A JPS5310266 A JP S5310266A
Authority
JP
Japan
Prior art keywords
semiconductor wafers
soldred
production
unifirom
layer thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8544576A
Other languages
Japanese (ja)
Inventor
Shizutaka Okubo
Toshihiro Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8544576A priority Critical patent/JPS5310266A/en
Publication of JPS5310266A publication Critical patent/JPS5310266A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To obtain soldered semiconductor wafers of a unifirom solder layer thickness by not applying metal plating to the side faces of the semiconductor wafers.
COPYRIGHT: (C)1978,JPO&Japio
JP8544576A 1976-07-16 1976-07-16 Production of soldred semiconductor wafers Pending JPS5310266A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8544576A JPS5310266A (en) 1976-07-16 1976-07-16 Production of soldred semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8544576A JPS5310266A (en) 1976-07-16 1976-07-16 Production of soldred semiconductor wafers

Publications (1)

Publication Number Publication Date
JPS5310266A true JPS5310266A (en) 1978-01-30

Family

ID=13859062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8544576A Pending JPS5310266A (en) 1976-07-16 1976-07-16 Production of soldred semiconductor wafers

Country Status (1)

Country Link
JP (1) JPS5310266A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55155269A (en) * 1979-05-22 1980-12-03 Nec Corp Doppler detection system for active sonar unit
JPS5817551U (en) * 1981-07-29 1983-02-03 三菱電機株式会社 Ultrasonic flaw detection equipment
JPS60127482A (en) * 1983-12-14 1985-07-08 Furuno Electric Co Ltd Interference removing apparatus of sonar or similar apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55155269A (en) * 1979-05-22 1980-12-03 Nec Corp Doppler detection system for active sonar unit
JPS5817551U (en) * 1981-07-29 1983-02-03 三菱電機株式会社 Ultrasonic flaw detection equipment
JPS60127482A (en) * 1983-12-14 1985-07-08 Furuno Electric Co Ltd Interference removing apparatus of sonar or similar apparatus

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