JPS5321570A - Bonding method of semiconductor substrates - Google Patents

Bonding method of semiconductor substrates

Info

Publication number
JPS5321570A
JPS5321570A JP9652676A JP9652676A JPS5321570A JP S5321570 A JPS5321570 A JP S5321570A JP 9652676 A JP9652676 A JP 9652676A JP 9652676 A JP9652676 A JP 9652676A JP S5321570 A JPS5321570 A JP S5321570A
Authority
JP
Japan
Prior art keywords
bonding method
semiconductor substrates
substrate
bonding
tilting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9652676A
Other languages
Japanese (ja)
Other versions
JPS5723417B2 (en
Inventor
Tsukasa Sawaki
Kenji Mitsui
Yoichi Okabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP9652676A priority Critical patent/JPS5321570A/en
Publication of JPS5321570A publication Critical patent/JPS5321570A/en
Publication of JPS5723417B2 publication Critical patent/JPS5723417B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To perform high quality bonding by tilting and contacting the bonding surface of a substrate and the surface of a header and causing eutectic alloying to take place from one end of the substrate.
COPYRIGHT: (C)1978,JPO&Japio
JP9652676A 1976-08-11 1976-08-11 Bonding method of semiconductor substrates Granted JPS5321570A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9652676A JPS5321570A (en) 1976-08-11 1976-08-11 Bonding method of semiconductor substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9652676A JPS5321570A (en) 1976-08-11 1976-08-11 Bonding method of semiconductor substrates

Publications (2)

Publication Number Publication Date
JPS5321570A true JPS5321570A (en) 1978-02-28
JPS5723417B2 JPS5723417B2 (en) 1982-05-18

Family

ID=14167572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9652676A Granted JPS5321570A (en) 1976-08-11 1976-08-11 Bonding method of semiconductor substrates

Country Status (1)

Country Link
JP (1) JPS5321570A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6175532A (en) * 1984-09-20 1986-04-17 Mitsubishi Electric Corp Soldering method for semiconductor element
JPH02181447A (en) * 1989-01-06 1990-07-16 Matsushita Electric Ind Co Ltd Die bonding device
JP2015219436A (en) * 2014-05-20 2015-12-07 住友電気工業株式会社 Method and apparatus for manufacturing optical module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6237509A (en) * 1985-08-12 1987-02-18 Sanshin Ind Co Ltd Crankshaft of multi-cylinder internal combustion engine

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49122668A (en) * 1973-03-23 1974-11-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49122668A (en) * 1973-03-23 1974-11-22

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6175532A (en) * 1984-09-20 1986-04-17 Mitsubishi Electric Corp Soldering method for semiconductor element
JPH02181447A (en) * 1989-01-06 1990-07-16 Matsushita Electric Ind Co Ltd Die bonding device
JP2015219436A (en) * 2014-05-20 2015-12-07 住友電気工業株式会社 Method and apparatus for manufacturing optical module

Also Published As

Publication number Publication date
JPS5723417B2 (en) 1982-05-18

Similar Documents

Publication Publication Date Title
JPS5321570A (en) Bonding method of semiconductor substrates
JPS52147064A (en) Semiconductor device
JPS5220782A (en) Semi-conductor element mounting method
JPS5380985A (en) Semiconductor device
JPS5230167A (en) Method for production of semiconductor device
JPS53105366A (en) Manufacture for semiconductor element substrate
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS5310266A (en) Production of soldred semiconductor wafers
JPS52143763A (en) Soldering method to holding substrate for semiconductor substrates
JPS53116072A (en) Electrode forming method for semiconductor device
JPS5245270A (en) Semiconductor device
JPS52141565A (en) Manufacture of semiconductor unit
JPS5345173A (en) Production of semiconductor device
JPS5244566A (en) Method of alloying semiconductor pellet
JPS5383598A (en) Glass substrate
JPS51122375A (en) Semiconductor device
JPS5228261A (en) Process for forming semiconductor electrodes
JPS5240084A (en) Process for production of semiconductor devices
JPS5285467A (en) Semiconductor electrode for solder connection
JPS5311577A (en) Soldering method for wafers of semiconductor devices
JPS52130292A (en) Patterning method
JPS5263674A (en) Semiconductor device
JPS5315760A (en) Production of semiconductor device
JPS524783A (en) Molecular beam crystal growth method
JPS5383579A (en) Manufacture of semiconductor device