JPS5315760A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5315760A
JPS5315760A JP9064476A JP9064476A JPS5315760A JP S5315760 A JPS5315760 A JP S5315760A JP 9064476 A JP9064476 A JP 9064476A JP 9064476 A JP9064476 A JP 9064476A JP S5315760 A JPS5315760 A JP S5315760A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
wafer
letting
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9064476A
Other languages
Japanese (ja)
Inventor
Mitsuyoshi Takeda
Takahiko Ichimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9064476A priority Critical patent/JPS5315760A/en
Publication of JPS5315760A publication Critical patent/JPS5315760A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent the cracking of wafers by letting the force to be applied to the wafer act below the point of application of the buoyancy acting on the wafer so as to dip the wafer into molten solder.
COPYRIGHT: (C)1978,JPO&Japio
JP9064476A 1976-07-28 1976-07-28 Production of semiconductor device Pending JPS5315760A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9064476A JPS5315760A (en) 1976-07-28 1976-07-28 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9064476A JPS5315760A (en) 1976-07-28 1976-07-28 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5315760A true JPS5315760A (en) 1978-02-14

Family

ID=14004204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9064476A Pending JPS5315760A (en) 1976-07-28 1976-07-28 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5315760A (en)

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