JPS5214390A - Iii-v compound semiconductor device and its process for fabrication - Google Patents

Iii-v compound semiconductor device and its process for fabrication

Info

Publication number
JPS5214390A
JPS5214390A JP9008275A JP9008275A JPS5214390A JP S5214390 A JPS5214390 A JP S5214390A JP 9008275 A JP9008275 A JP 9008275A JP 9008275 A JP9008275 A JP 9008275A JP S5214390 A JPS5214390 A JP S5214390A
Authority
JP
Japan
Prior art keywords
iii
compound semiconductor
fabrication
semiconductor device
junction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9008275A
Other languages
Japanese (ja)
Inventor
Yasutoshi Kurihara
Tadahiko Mitsuyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9008275A priority Critical patent/JPS5214390A/en
Publication of JPS5214390A publication Critical patent/JPS5214390A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE: To avoid deterioration of device characteristics by surrounding P - N junction of III - V compound semiconductor with dielectric III - V compounds.
COPYRIGHT: (C)1977,JPO&Japio
JP9008275A 1975-07-25 1975-07-25 Iii-v compound semiconductor device and its process for fabrication Pending JPS5214390A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9008275A JPS5214390A (en) 1975-07-25 1975-07-25 Iii-v compound semiconductor device and its process for fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9008275A JPS5214390A (en) 1975-07-25 1975-07-25 Iii-v compound semiconductor device and its process for fabrication

Publications (1)

Publication Number Publication Date
JPS5214390A true JPS5214390A (en) 1977-02-03

Family

ID=13988588

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9008275A Pending JPS5214390A (en) 1975-07-25 1975-07-25 Iii-v compound semiconductor device and its process for fabrication

Country Status (1)

Country Link
JP (1) JPS5214390A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04273174A (en) * 1991-02-28 1992-09-29 Sharp Corp Semiconductor light emitting element and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04273174A (en) * 1991-02-28 1992-09-29 Sharp Corp Semiconductor light emitting element and method of manufacturing the same

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